Method of making a semiconductor radiation emitter package
First Claim
1. A method of making a semiconductor radiation emitter package comprising:
- forming a leadframe assembly from a sheet, roll, or strip of electrical and thermally conductive material, the leadframe assembly having a heat extraction element and a plurality of leads having a greater thermal resistance than the heat extraction element, at least one tie-bar connecting at least one of said plurality of leads to another;
bonding at least one semiconductor radiation emitter directly to said heat extraction element with one or more bonding materials, each semiconductor radiation emitter having a plurality of electrodes;
forming an electrical connection between said at least one of the electrodes and said at least one lead;
encapsulating said at least one semiconductor radiation emitter with a material substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter while also encapsulating portions of said heat extraction element and said electrical leads such that some surfaces of said heat extraction element and some surfaces of said electrical leads are left unencapsulated; and
cutting said at least one tie-bar.
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Abstract
A semiconductor optical radiation package includes a leadframe, at least one semiconductor optical radiation emitter, and an encapsulant. The leadframe has a heat extraction member, which supports the semiconductor optical emitter and provides one or more thermal paths for removing heat generated within the emitter to the ambient environment, as well as at least two electrical leads for providing electrical coupling to the semiconductor optical radiation emitter. The encapsulant covers and protects the emitter and optional wire bonds from damage and allows radiation to be emitted from the emitter into the ambient environment. The semiconductor optical radiation package provides high emitted flux and is preferably compatible with automated processing techniques.
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Citations
43 Claims
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1. A method of making a semiconductor radiation emitter package comprising:
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forming a leadframe assembly from a sheet, roll, or strip of electrical and thermally conductive material, the leadframe assembly having a heat extraction element and a plurality of leads having a greater thermal resistance than the heat extraction element, at least one tie-bar connecting at least one of said plurality of leads to another;
bonding at least one semiconductor radiation emitter directly to said heat extraction element with one or more bonding materials, each semiconductor radiation emitter having a plurality of electrodes;
forming an electrical connection between said at least one of the electrodes and said at least one lead;
encapsulating said at least one semiconductor radiation emitter with a material substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter while also encapsulating portions of said heat extraction element and said electrical leads such that some surfaces of said heat extraction element and some surfaces of said electrical leads are left unencapsulated; and
cutting said at least one tie-bar. - View Dependent Claims (6, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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2. A method of making a plurality of semiconductor radiation emitter packages comprising the steps of:
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forming a multi-leadframe assembly from a sheet, roll, or strip of electrically and thermally conductive material, the multi-leadframe assembly having a plurality of leadframes each including a heat extraction element, a plurality of leads having greater thermal resistance than said heat extraction element, and a recessed optically reflective cup formed in said heat extraction element, said multi-leadframe assembly further including at least one tie-bar connecting one of said plurality of leadframes to another;
mounting at least one semiconductor radiation emitter on said heat extraction element and within said recessed optically reflective cup of more than one of said leadframes in the multi-leadframe assembly such that at least a portion of the radiation emitted from each of said at least one semiconductor radiation emitter within said recessed optically reflective cup is reflected by said recessed optically reflective cup, each semiconductor radiation emitter having a plurality of electrodes;
forming an electrical connection between at least one of said electrodes of said at least one said semiconductor radiation emitter and said at least one of said plurality of leads of a corresponding one of said leadframes; and
on more than one of said plurality of leadframes and on a corresponding one of said at least one semiconductor radiation emitter, encapsulating said at least one semiconductor radiation emitter with a material substantially transparent to wavelengths emitted by the at least one semiconductor radiation emitter while also encapsulating portions of said heat extraction element and said electrical leads such that some surfaces of said heat extraction element and some surfaces of said electrical leads are left unencapsulated;
so as to create a plurality of interconnected semiconductor radiation emitter packages. - View Dependent Claims (3, 4, 5, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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41. A method of making a semiconductor radiation emitter package comprising:
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forming a leadframe assembly from a sheet, roll, or strip of electrically and thermally conductive material, the leadframe assembly having a heat extraction element and a plurality of leads having a greater thermal resistance than the heat extraction element, at least one tie-bar connecting at least one of said plurality of leads to another;
mounting at least one semiconductor radiation emitter on a first surface of said heat extraction element, each semiconductor radiation emitter having a plurality of electrodes;
forming an electrical connection between at least one of the electrodes and said at least one lead;
encapsulating said at least one semiconductor radiation emitter with an encapsulant material substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter, said encapsulant material covering a portion of the first surface of said heat extraction element, while leaving exposed at least a portion of a second surface of said heat extraction element that is opposite the first surface, the exposed portion of the second surface being directly opposite an area of the first surface where said at least one semiconductor radiation emitter is mounted; and
breaking, cutting, or removing said at least one tie-bar.
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42. A method of making a semiconductor radiation emitter package comprising:
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forming a leadframe assembly from a sheet, roll, or strip of electrically and thermally conductive material, the leadframe assembly having a heat extraction element, a plurality of leads having a greater thermal resistance than said heat extraction element, and at least one tie-bar connecting at least one lead of said plurality of leads to another, the heat extraction element having a thickness in a direction that is substantially parallel to the direction in which radiation is emitted from the semiconductor radiation emitter package that is greater than the thickness of the electrical leads;
mounting at least one semiconductor radiation emitter on the heat extraction element, each semiconductor radiation emitter having a plurality of electrodes;
forming an electrical connection between at least one of the electrodes and said at least one lead;
encapsulating said at least one semiconductor radiation emitter with an encapsulant material substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter; and
breaking, cutting, or removing said at least one tie-bar. - View Dependent Claims (43)
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Specification