Compact slotted-waveguide spatial power divider/combiner/amplifier

• US 6,828,875 B2
• Filed: 12/09/2002
• Issued: 12/07/2004
• Est. Priority Date: 12/09/2002
• Status: Expired due to Fees

• Current Assignee: Cobham Defense Electronic Systems Corporation (Cobham PLC)
• Original Assignee: Mia-Com Incorporated
• Inventors: Anderson, Richard Alan, Kinayman, Noyan, Hongsmatip, Thongchai, Ziegner, Bernhard A., Channabasappa, Eswarappa
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US10/315,528
• Publication Number:
  US 20040108903A1
• Time in Patent Office: 729 Days
• Field of Search: 333/125, 333/136, 333/137, 333/26, 333/34, 330/286, 330/295
• US Class Current: 333/137
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 5/16 Conjugate devices, i.e. devices having at least one port decoupled from one other port

Abstract

A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.

Claims

1. A spatial power divider/combiner, comprising:

a housing having a first channel and a second channel;

at least one board having a top side and an underside, said underside of said board coupled to said housing;

a input waveguide formed by said first channel and the underside of said at least one board for receiving an input signal;

a output waveguide formed by said second channel and the underside of said at least one board for outputting an output signal;

a plurality of microstrip lines formed on said at least one board;

a first series of slots formed on said underside of said at least one board in said input waveguide for dividing an input signal into a plurality of divided signals, wherein each slot of said first series of slots is coupled to one microstrip line; and

a second series of slots formed on said underside of said at least one board in said output waveguide for combining a plurality of divided signals, wherein each slot of said second series of slots is coupled to one microstrip line.

2. A divider/combiner as set forth in claim 1, wherein said input waveguide and said output waveguide are rectangular waveguides.

3. A divider/combiner as set forth in claim 1, wherein said plurality of microstrip lines are formed on the top side of said at least one board.

4. A divider/combiner as set forth in claim 1, wherein said plurality of microstrip lines each have at least one tapered end, wherein said tapered end is coupled to a slot from said first series of slots or said second series of slots.

5. A divider/combiner as set forth in claim 4, wherein the impedance of each slot of said first series or said second series of slots is matched to the impedance of said at least one tapered end of said microstrip line coupled to the respective slot.

6. A divider/combiner as set forth in claim 1, further comprising:

a plurality of active devices, said active devices used to process said plurality of divided signals.

7. A divider/combiner as set forth in claim 6, wherein said at least one board comprises a first board and a second board.

8. A divider/combiner as set forth in claim 7, wherein a separation is provided between said first board and said second board.

9. A divider/combiner as set forth in claim 8, wherein each device of said plurality of active devices is mounted to said housing in said separation.

10. A divider/combiner as set forth in claim 7, wherein each device of said plurality of active devices is mounted to a carrier plate, and said carrier plate is mounted to said housing.

11. A divider/combiner as set forth in claim 10, wherein said carrier plate comprises copper tungsten material.

12. A divider/combiner as set forth in claim 7, wherein said plurality of microstrip lines comprises a first plurality of microstrip lines on the top side of said first board and a second plurality of microstrip lines on the top side of said second board.

13. A divider/combiner as set forth in claim 12, wherein said first plurality and said second plurality of microstrip lines each have at least one tapered end, wherein said at least one tapered end is coupled to a slot from said first series of slots or said second series of slots.

14. A divider/combiner as set forth in claim 13, wherein the impedance of each slot of said first series or said second series of slots is matched to the impedance of said at least one tapered end of said microstrip line coupled to the respective slot.

15. A divider/combiner as set forth in claim 6, wherein a gain of approximately 7 dBm is measured from said input signal to said output signal.

16. A divider/combiner as set forth in claim 6, wherein said plurality of active devices comprises a series of MMIC power amplifiers.

17. A divider/combiner as set forth in claim 1, wherein the amplitude of said output signal is approximately 80% of the amplitude of said input signal.

18. A spatial power coupler, comprising:

a housing having a channel;

at least one board having a top side and an underside, said underside of said board coupled to said housing;

a waveguide formed by said channel and the underside of said at least one board;

a plurality of microstrip lines formed on said at least one board;

a series of slots formed on said underside of said at least one board in said waveguide, wherein each slot of said series of slots is coupled to one microstrip line.

19. A spatial power coupler as set forth in claim 18, further comprising a plurality of active devices electrically connected to said plurality of microstrip lines.

20. A spatial power coupler as set forth in claim 19, wherein each device of said plurality of active devices is mounted to said housing.

21. A spatial power coupler as set forth in claim 19, wherein each device of said plurality of active devices is mounted to a carrier plate, and said carrier plate is mounted to said housing.

22. A spatial power coupler as set forth in claim 21, wherein said carrier plate comprises copper tungsten material.

23. A spatial power coupler as set forth in claim 19, wherein said plurality of active devices comprises a series of MMIC power amplifiers.

24. A spatial power coupler as set forth in claim 18, wherein said waveguide is a rectangular waveguide.

25. A spatial power coupler as set forth in claim 18, wherein said plurality of microstrip lines are formed on the top side of said at least one board.

26. A spatial power coupler as set forth in claim 18, wherein said plurality of microstrip lines each have at least one tapered end, wherein said tapered end is coupled to a slot from said series of slots.

27. A spatial power coupler as set forth in claim 26, wherein the impedance of each slot of said series of slots is matched to the impedance of said at least one tapered end of said microstrip line coupled to the respective slot.

28. A spatial power coupler as set forth in claim 18, wherein said waveguide is an input waveguide and said microstrip lines are output microstrip lines, such that the spatial power coupler is a power splitter.

29. A spatial power coupler as set in claim 18, wherein said microstrip lines are input microstrip lines and said waveguide is an output waveguide, such that the spatial power coupler is a power combiner.