High speed multi-stage switching network formed from stacked switching layers
First Claim
1. A compact multi-stage switching network adapted for simultaneously routing a plurality of data packets from a plurality of input ports to selected ones of a plurality of output ports comprising:
- a first stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a second stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a third stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit; and
means for interconnecting each of the plurality of IC layers in the first stack of IC layers to each of the plurality of IC layers in the second stack of IC layers and for interconnecting each of the plurality of IC layers in the second stack of IC layers to each of the plurality of IC layers in the third stack of IC layers to form the compact multi-stage switching network.
8 Assignments
0 Petitions
Accused Products
Abstract
A compact multi-stage switching network (100), and a router (510) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports (110) to selected ones of a second plurality of output ports (190) comprising: a first stack (140) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit (142); a second stack (160) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer (113) containing at least one switching element circuit (162); and interconnecting circuitry (150) that connects the first stack (140) of IC layers to the second stack (160) of IC layers to form the compact multi-stage switching network. The stacks (140, 160) are preferably mated to one another in a transverse fashion in order to achieve a natural full-mesh connection. Also contemplated are the use of superconducting IC switching circuits (142) and a suitable superconducting cooling housing (730), as permitted by the compact nature of the multi-stage switching network (100), in order to operate at high speed and low power.
-
Citations
19 Claims
-
1. A compact multi-stage switching network adapted for simultaneously routing a plurality of data packets from a plurality of input ports to selected ones of a plurality of output ports comprising:
-
a first stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a second stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a third stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit; and
means for interconnecting each of the plurality of IC layers in the first stack of IC layers to each of the plurality of IC layers in the second stack of IC layers and for interconnecting each of the plurality of IC layers in the second stack of IC layers to each of the plurality of IC layers in the third stack of IC layers to form the compact multi-stage switching network. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A packet switching router adapted for forwarding data packets comprising:
-
a plurality of line cards for receiving and transmitting data packets according to a desired protocol over a particular medium, a first line card inspecting destination data in the packet, selecting a desired route, and setting a switch command based on the desired route;
a compact multi-stage switching network havinga first stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit;
a second stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit; and
a third stack of IC layers including a plurality of IC switching layers that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit; and
means for interconnecting each of the plurality of IC layers in the first stack of IC layers to each of the plurality of IC layers in the second stack of IC layers and for interconnecting each of the plurality of IC layers in the second stack of IC layers to each of the plurality of IC layers in the third stack of IC layers to form the compact multi-stage switching network. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
a shared resource that is commonly available to the line cards; and
means for controllably connecting a line card to the shared resources through the extra switching routes.
-
-
18. The packet switching router of claim 10 wherein each switching layer comprises an IC switching die of superconducting construction and further comprising means for cooling the multi-stage switching network to a superconducting temperature.
-
19. The compact multi-stage switching network of claim 10 wherein each switching layer comprises a neo-chip layer having an IC switching die of superconducting construction embedded in a first dielectric material.
Specification