Device for creating a neural interface and method for making same

• US 6,829,498 B2
• Filed: 11/16/2001
• Issued: 12/07/2004
• Est. Priority Date: 03/29/2000
• Status: Expired due to Fees

• Current Assignee: Arizona Board of Regents (University of Arizona)
• Original Assignee: Arizona Board of Regents (University of Arizona)
• Inventors: Pellinen, David S., Williams, Justin, Kipke, Daryl, Rousche, Patrick, Pivin, David
• Primary Examiner(s): Cohen, Lee S.
• Application Number:
  US09/979,320
• Publication Number:
  US 20030100823A1
• Time in Patent Office: 1,117 Days
• Field of Search: 600/373, 600/378, 600/379, 607/116, 607/117, 607/118, 298/25
• US Class Current: 600/378
• CPC Class Codes: A61B 2562/187 Strain relief means
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/4041 Evaluating nerves condition
• CPC Class Codes: A61B 5/4047 afferent nerves, i.e. nerves that relay impulses to the central nervous system
• CPC Class Codes: A61B 5/685 Microneedles
• CPC Class Codes: A61N 1/0531 Brain cortex electrodes
• CPC Class Codes: Y10S 977/936 in a transistor or 3-terminal device
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An implant device for creating a neural interface with the central nervous system having a polyimide-based electrode array is presented along with a method for making the device. The device may be configured as a three dimensional structure and is capable of sensing multi-unit neural activity from the cerebral cortex. Mechanical, electrical and biological characteristics of the device support its use as a reliable, long term implant.

Claims

1. An implant device for creating a neural interface with the central nervous system comprising at least one electrode sandwiched within a bi-layer polyimide insulating substrate and at least one via formed within said bi-layer polyimide substrate, wherein said via is separate and apart from said electrode.

2. The device of claim 1 further comprising at least one bioactive species contained within said via.

3. The device of claim 1 further comprising at least one shaft and wherein said electrode and via are located on said shaft.

4. The device of claim 3 wherein said shaft is bent to create a three-dimensional device structure.

5. The device of claim 1 further comprising a feedthrough interconnect system for connecting the device to at least one connector pin.

6. The device of claim 1 wherein said bi-layer polyimide substrate is flexible.

7. An implant device for creating a neural interface with the central nervous system comprising:

a first flexible thermoplastic layer;

a second flexible thermoplastic layer;

a metal layer sandwiched between said first and second layers;

at least one electrode formed from said metal layer; and

at least one via formed within said first and second layers, wherein said via is separate and apart from said electrode.

8. The implant of claim 7 wherein said first and second flexible thermoplastic layers comprise a polyimide.

9. The implant of claim 7 further comprising at least one bioactive species contained within said via.

10. The implant of claim 9 wherein said implant comprises at least two or more vias and each of said vias contains a different bioactive species.

11. The implant of claim 7 further comprising at least one wire trace connected to said electrode.

12. The implant of claim 7 wherein said implant is bent to create a three-dimensional structure.

13. The implant of claim 7 wherein said electrode and said via are located on a shaft.

14. The implant of claim 13 wherein said electrode has an exposed site size within a range of about 20-40 microns by 20-40 microns.

15. The implant of claim 13 wherein said shaft is preferably about 1.5 millimeters in length.

16. The implant of claim 13 wherein said shaft preferably has a width of about 160 microns and a thickness of less than 20 microns.

17. The implant of claim 13 wherein said shaft is bent to create a three-dimensional implant.

18. The implant of claim 7 further comprising two or more shafts wherein at least one electrode and at least one via is located on each shaft.

19. The implant of claim 18 wherein said shafts are bent to create a three-dimensional implant.

20. The implant of claim 7 wherein said via is preferably located about 40 micrometers from said electrode.

21. The implant of claim 7 further comprising a feedthrough interconnect system for connecting the implant to at least one individual connector pin.

22. An electrode array for creating a multi-channel neural interface with the central nervous system comprising:

at least two electrodes sandwiched within a bi-layer polyimide insulating substrate; and

at least one via formed within said bi-layer polyimide insulating substrate wherein said via is separate and apart from said electrodes.

23. A The electrode array of claim 22 further comprising at least one bioactive species contained within said via.

24. The electrode array of claim 22 further comprising at least one shaft wherein said electrodes and said via are located on said shaft.

25. The electrode array of claim 24 wherein said shaft is bent to form a three-dimensional structure.

26. The electrode array of claim 24 further comprising a plurality of electrode recording pads connected to said electrodes via a feedthrough interconnect system.

27. The electrode array of claim 26 further comprising a separate connector pin connected to each of said recording pads.

28. A method for making a device for creating a neural interface with the central nervous system comprising the steps of

providing a silicon substrate;

growing an oxide layer over said silicon substrate;

depositing and processing a first polyimide layer over said oxide layer;

depositing and patterning a conductive layer over said first polyimide layer;

depositing and processing a second polyimide layer over said conductive layer to form at least one electrode and at least one via in said polyimide layers wherein said via is separate and apart from said electrode; and

dissolving said oxide layer.

29. The method of claim 28 wherein said electrode and via are located on a shaft of the device which can be bent to form a three-dimensional configuration.

30. The method of claim 29 wherein an electrode array and multiple vias are formed within one or more shafts to provide a multi-channel neural interface.

31. The method of claim 28 further comprising the step of curing a surface of the device after the steps of depositing and processing the first and second polyimide layers.

32. The method of claim 31 further comprising the step of etching a surface of the device with a reactive ion after curing roughen the surface of the device for further, processing.

33. The method of claim 28 further comprising the step of fitting the electrode released from the dissolving step on at least one connector.

34. The method of claim 33 further comprising the step of applying a conductive epoxy to a connector site to complete an electrical connection between the electrode and connector.

35. The method of claim 34 further comprising the step of applying an adhesive to the connector site for adhering the device to a subject.