Process of making an all-silicon microphone

• US 6,829,814 B1
• Filed: 08/29/2002
• Issued: 12/14/2004
• Est. Priority Date: 08/29/2002
• Status: Expired due to Term

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Betzner, Timothy M., Freeman, John E., Long, Stephen P, Queen, George M, Christenson, John C., Chilcott, Dan W., Baney, William J., Vas, Timothy A.
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/231,325
• Time in Patent Office: 838 Days
• Field of Search: 29/254.1, 29/254.2, 295/94, 438/33, 438/42, 438/45, 381/170, 381/171, 381/174, 381/175
• US Class Current: 29/594
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/00666 Treatments for controlling internal stress or strain in MEMS structures
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

Claims

1. A process of forming a capacitive audio transducer, the process comprising the steps of:

providing a first wafer having a substrate and a first single-crystal silicon layer doped with boron and germanium so as to be p-type;

forming on the first single-crystal silicon layer a second single-crystal silicon layer;

forming a recess in the second single-crystal silicon layer so as to expose a portion of the first single-crystal silicon layer, the portion of the first single-crystal silicon layer defining a first capacitor plate of the capacitive audio transducer;

providing a second wafer having a substrate and a third single-crystal silicon layer doped with boron and germanium so as to be p-type;

bonding the first and second wafers together so that the recess in the second single-crystal silicon layer defines a cavity between the first and third single-crystal silicon layers; and

removing at least portions of the substrates of the first and second wafers to expose a portion of the first single-crystal silicon layer defining the first capacitor plate and to expose a portion of the third single-crystal silicon layer that is spaced apart from the first single-crystal silicon layer by the cavity, the portion of the third single-crystal silicon layer defining a second capacitor plate that is capacitively coupled to the first capacitor plate of the capacitive audio transducer, one of the first and second capacitor plates being movable in response to impingement by sound vibrations;

wherein a capacitive output signal is produced in response to changes in the distance between the first and second capacitor plates that occur as a result of sound-induced vibration.

2. A process according to claim 1, wherein the first and third single-crystal silicon layers are epitaxially grown on the first and second wafers, respectively.

3. A process according to claim 1, wherein the third single-crystal silicon layer is formed on the second wafer to be thinner than the first single-crystal silicon layer on the first wafer, and the second capacitor plate is movable in response to impingement by sound vibrations.

4. A process according to claim 1, wherein the removing step comprises etching through the substrate of the first wafer to define a cavity that exposes the first single-crystal silicon layer, and using the first single-crystal silicon layer as an etch stop as a result of the boron and germanium content therein.

5. A process according to claim 1, wherein the removing step comprises etching through the substrate of the second wafer and using the third single-crystal silicon layer as an etch stop as a result of the boron and germanium content therein.

6. A process according to claim 1, further comprising the step of forming stiction bumps within the recess following the step of forming the recess in the second single-crystal silicon layer.

7. A process according to claim 1, wherein the step of forming the recess in the second single-crystal silicon layer simultaneously produces accesses for electrical contact to the first single-crystal silicon layer through the second single-crystal silicon layer.

8. A process according to claim 7, wherein the step of forming the recess in the second single-crystal silicon layer comprises a deep reactive ion etch technique.

9. A process according to claim 1, further comprising the step of providing a vent to the cavity through the first single-crystal silicon layer, a first portion of the vent being formed by etching through the first single-crystal silicon layer after the step of forming the recess in the second single-crystal silicon layer and before the bonding step.

10. A process according to claim 9, wherein the step of forming the first portion of the vent comprises a deep reactive ion etch technique.

11. A process according to claim 9, wherein a second portion of the vent is formed when removing the portion of the substrate of the first wafer to expose the portion of the first single-crystal silicon layer defining the first capacitor plate.

12. A process according to claim 9, further comprising the steps of:

forming an oxide layer on surfaces of the vent before the bonding step;

exposing a portion of the oxide layer during the step of removing the portion of the first wafer; and

then

breaching the oxide layer to open the vent.

13. A process according to claim 9, wherein the first portion of the vent is etched by deep reactive ion etching, and at least one isolation trench that circumscribes the vent is simultaneously formed during deep reactive ion etching of the vent, the isolation trench extending down through the first and second single-crystal silicon layers and into the substrate of the first wafer.

14. A process according to claim 1, further comprising the step of, before the bonding step, forming an oxide layer on the second single-crystal silicon layer, wherein during the bonding step the oxide layer is bonded to the third single-crystal silicon layer of the second wafer.

15. A process according to claim 14, further comprising the step of patterning the oxide layer to define peninsula-shaped oxide regions surrounding and extending toward the recess in the second single-crystal silicon layer, wherein during the bonding step the oxide layer and the oxide regions are bonded to the third single-crystal silicon layer of the second wafer.

16. A process according to claim 15, wherein the step of patterning the oxide layer causes the peninsula-shaped oxide regions to have a triangular shape whose width narrows toward the recess.

17. A process according to claim 15, wherein the step of patterning the oxide layer causes the peninsula-shaped oxide regions to have an elongate shape extending circumferentially along the perimeter of the recess.

18. A process according to claim 15, wherein the step of removing at least portions of the substrates to expose a portion of the third single-crystal silicon layer and define the second capacitor plate comprises patterning the second capacitor plate to have tabs that project radially outward from the second capacitor plate and are bonded to the peninsulas.

19. A process according to claim 14, further comprising the step of patterning the oxide layer to produce countersunk accesses in the oxide layer for electrical contact to the first single-crystal silicon layer through the second single-crystal silicon layer.

20. A process according to claim 14, wherein the combined thickness of the oxide layer and the second single-crystal silicon layer establishes the distance between the first and second capacitor plates.

21. A process according to claim 1, wherein the second single-crystal silicon layer is more lightly doped than the first single-crystal silicon layer.

22. A process according to claim 1, wherein the removal of the portion of the substrate of the first wafer to expose the portion of the first single-crystal silicon layer is performed in a single etching step subsequent to the removal of the portion of the second wafer.

23. A process according to claim 1, wherein the removal of the portion of the substrate of the first wafer to expose the portion of the first single-crystal silicon layer comprises first and second etching steps in which the portion of the first single-crystal silicon layer is exposed only at the completion of the second etching step, the first etching step being performed simultaneously with removal of the portion of the substrate of the second wafer.

24. A process according to claim 1, wherein the removal of the portion of the substrate of the second wafer to expose the portion of the third single-crystal silicon layer includes moving the entire substrate of the second wafer and comprises first and second etching steps in which the portion of the third single-crystal silicon layer is exposed only at the completion of the second etching step.

25. A process according to claim 1, wherein the substrates of the first and second wafers are n-type silicon.