Substrate which is made from paper and is provided with an integrated circuit

• US 6,830,192 B1
• Filed: 10/20/2000
• Issued: 12/14/2004
• Est. Priority Date: 04/20/1998
• Status: Expired due to Fees

• Current Assignee: Arjowiggins Sas (UFK Management Holding GmbH)
• Original Assignee: VHP Veiligheidspapierfabriek Ugchelen B.V. (Antalis Ltd.), Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: de Leeuw, Dagobert Michel, Hart, Cornelius Maria, Krul, Johannes, Matters, Marco, de Hesse, Wilhelm Bernardus
• Primary Examiner(s): FUREMAN, JARED
• Application Number:
  US09/692,371
• Time in Patent Office: 1,516 Days
• Field of Search: 235/487, 235/492, 235/441, 235/451, 902/1, 902/25, 902/26, 902/29, 283/72, 283/83, 283/98, 283/86, 283/70, 163/163, 340/572.7, 340/572.1, 340/572.8, 257/40, 257/774, 361/725
• US Class Current: 235/492
• CPC Class Codes: D21H 21/48 Elements suited for physical verification, e.g. by irradiation
• CPC Class Codes: G06K 19/02 characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• CPC Class Codes: G06K 19/07743 External electrical contacts

Abstract

The invention relates to a substrate which is made from paper and is provided with at least one integrated circuit which is produced from a semiconductive organic polymer. A semiconductive organic polymer of this nature, when used as the base material for the integrated circuit, leads to the possibility of directly producing the substrate in the required thickness, to the need for support layers and/or protective layers being eliminated, and to the possibility of reducing the cost price of the substrate compared to substrates which comprise an integrated circuit of the silicon type.

Claims

1. A security thread comprising an insulating support bearing a flexible integrated circuit comprising a semiconductive organic polymer, provided with electrical contacts for the integrated circuit.

2. The substrate according to claim 1, wherein the organic polymer is selected from conjugated polymers.

3. The substrate according to claim 1, wherein the organic polymer is selected from oligomeric pentacene, poly(thienylene vinylene) or poly-3 alkylthiophene.

4. The substrate according to claim 1, wherein the integrated circuit is a contactlessly readable integrated circuit which can be read in an inductive or capacitive manner.

5. The substrate according to claim 1, wherein the integrated circuit forms part of an optical active element.

6. The substrate according to claim 1, wherein the integrated circuit comprises a preprogrammed code which is applied before incorporating the circuit in the substrate.

7. The substrate according to claim 6, wherein the code is an encrypted code.

8. A substrate according to claim 1, wherein the integrated circuit comprises a code of an intrinsic property of the substrate, which code, after the substrate has been produced, is arranged in the integrated circuit.

9. The substrate according to claim 1, wherein the substrate comprises additional security features.

10. The substrate according to claim 9, wherein an additional security feature is selected from a dye, fluorescent material, luminescent material or phosphorescent material.

11. The substrate according to claim 1, which further comprises an insulating layer on said semiconductive organic polymer.