Method for manufacturing semiconductor device

• US 6,830,617 B1
• Filed: 08/01/1996
• Issued: 12/14/2004
• Est. Priority Date: 08/02/1995
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Ohtani, Hisashi, Teramoto, Satoshi, Yamazaki, Shunpei, Miyanaga, Akiharu
• Primary Examiner(s): KUNEMUND, ROBERT M
• Application Number:
  US08/690,747
• Time in Patent Office: 3,057 Days
• Field of Search: 117/103, 117/939, 117/923, 117/95, 117/97
• US Class Current: 117/103
• CPC Class Codes: C30B 1/02 by thermal treatment, e.g. strain annealing C30B1/12 takes precedence
• CPC Class Codes: C30B 29/06 Silicon
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/02422 Non-crystalline insulating materials, e.g. glass, polymers
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02672 using crystallisation enhancing elements
• CPC Class Codes: H01L 21/02675 using laser beams
• CPC Class Codes: H01L 29/66757 Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate

Abstract

In a method for manufacturing a crystalline silicon film by utilizing a metal element that promotes the crystallization of silicon, an influence of this metal element can be suppressed.

A nickel element 104 is retained in contact with a surface of an amorphous silicon film 103 patterned to form a predetermined pattern in such a manner that the metal element is brought into contact with the amorphous silicon film 103 patterned to form a predetermined pattern. Next, the crystalline silicon film 105 is formed by a heat treatment. At this time, the nickel element is segregated in the edge region of the pattern. Further, a crystalline silicon film 100 having no region to which the metal element concentrated by patterning using a mask 107. By using this crystalline silicon film 100 as an active layer, the thin film transistor is fabricated.

Claims

1. A method for manufacturing a semiconductor device comprising the steps of:

forming a non-single crystalline semiconductor film on an insulating surface;

introducing ions of an element which is inert with respect to said semiconductor film into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

disposing a crystallization promoting material in contact with said semiconductor film;

crystallizing said semiconductor film by heating wherein said crystallization promoting material segregates in said selected region during the crystallization;

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

2. A method according to claim 1, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

3. A method for manufacturing a semiconductor device comprising the steps of:

forming a non-single crystalline semiconductor film on an insulating surface provided over a quartz substrate;

introducing ions of an element which is inert with respect to said semiconductor film into a selected portion of said semiconductor substrate using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

disposing a crystallization promoting material in contact with said semiconductor film;

crystallizing said semiconductor film by heating at a temperature of 800 to 1100°

C. wherein said crystallization promoting material segregates in said selected region during the crystallizing;

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

4. A method according to claim 3, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

5. A method for manufacturing a semiconductor device comprising:

providing a semiconductor film with a crystallization promoting material;

introducing phosphorus into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

crystallizing said semiconductor film with said selected region of said semiconductor film containing said phosphorus to getter said crystallization promoting material during said crystallizing;

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

6. The method of claim 5 wherein said gettering of said crystallization promoting material is caused by a gettering effect of said phosphorus.

7. The method of claim 5 wherein said semiconductor film comprises silicon.

8. The method of claim 5 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

9. A method according to claim 5, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

10. A method for manufacturing a semiconductor device comprising:

providing a semiconductor film with a crystallization promoting material;

introducing phosphorus into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

crystallizing said semiconductor film by heating with said selected region of said semiconductor film containing said phosphorus to getter said crystallization promoting material during said crystallizing;

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

11. The method of claim 10 wherein said gettering of said crystallization promoting material is caused by a gettering effect of said phosphorus.

12. The method of claim 10 wherein said semiconductor film comprises silicon.

13. The method of claim 10 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

14. A method according to claim 10, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

15. A method for manufacturing a semiconductor device comprising:

providing a semiconductor film with a crystallization promoting material;

introducing phosphorus into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

crystallizing said semiconductor film with said selected region of said semiconductor film containing said phosphorus to getter said crystallization promoting material during said crystallizing;

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

16. The method of claim 15 wherein said gettering of said crystallization promoting material is caused by a gettering effect of said phosphorus.

17. The method of claim 15 wherein said semiconductor film comprises silicon.

18. The method of claim 15 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

19. A method according to claim 15, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

20. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

heating said semiconductor film to getter said crystallization promoting material into said selected portion of said semiconductor film

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

21. The method of claim 20 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

22. The method of claim 20 further comprising the step of etching said selected portion of said semiconductor film.

23. The method of claim 20 wherein said semiconductor film comprises an amorphous silicon.

24. The method of claim 20 wherein said heating is conducted at a temperature of 450 to 700°

C.

25. The method of claim 20 wherein said heating is conducted at a temperature of 800 to 1100°

C.

26. A method according to claim 20, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

27. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

heating said semiconductor film to crystallize said semiconductor film using said crystallization promoting material and to getter said crystallization promoting material into said selected portion of said semiconductor film

forming a second mask over said semiconductor film; and

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of said semiconductor device.

28. The method of claim 27 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

29. The method of claim 27 further comprising the step of etching said selected portion of said semiconductor film.

30. The method of claim 27 wherein said semiconductor film comprises an amorphous silicon.

31. The method of claim 27 wherein said heating is conducted at a temperature of 450 to 700°

C.

32. The method of claim 27 wherein said heating is conducted at a temperature of 800 to 1100°

C.

33. A method according to claim 27, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

34. A method for manufacturing a semiconductor device comprising:

forming a semiconductor island comprising silicon over a substrate;

providing said semiconductor island with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor island;

heating said semiconductor island to getter said crystallization promoting material into said selected portion of said semiconductor island

removing said selected portion of said semiconductor island and a part of said semiconductor island adjacent to said selected portion in order to form an active layer of said semiconductor device.

35. The method of claim 34 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

36. The method of claim 34 further comprising the step of etching said selected portion of said semiconductor island.

37. The method of claim 34 wherein said semiconductor island comprises an amorphous silicon.

38. The method of claim 34 wherein said heating is conducted at a temperature of 450 to 700°

C.

39. The method of claim 34 wherein said heating is conducted at a temperature of 800 to 1100°

C.

41. The method of claim 39 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

40. A method for manufacturing a semiconductor device comprising:

forming a semiconductor island comprising silicon over a substrate;

providing said semiconductor island with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor island;

heating said semiconductor island to crystallize said semiconductor island using said crystallization promoting material and to getter said crystallization promoting material into said selected portion of said semiconductor island

removing said selected portion of said semiconductor island and a part of said semiconductor island adjacent to said selected portion in order to form an active layer of said semiconductor device.

42. The method of claim 40 further comprising the step of etching said selected portion of said semiconductor island.

43. The method of claim 40 wherein said semiconductor island comprises an amorphous silicon.

44. The method of claim 40 wherein said heating is conducted at a temperature of 450 to 700°

C.

45. The method of claim 40 wherein said heating is conducted at a temperature of 800 to 1100°

C.

46. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a mask provided over said semiconductor film;

heating said semiconductor film to getter said crystallization promoting material into said selected portion of said semiconductor film; and

etching said selected portion of said semiconductor film and a part of said semiconductor film covered with said mask in said introducing step after said heating to form an active layer of the semiconductor device,

wherein said part of said semiconductor film covered with said mask in said introducing step is adjacent to said selected portion.

47. The method of claim 46 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

48. The method of claim 46 wherein said semiconductor film is formed into a semiconductor island.

49. The method of claim 46 wherein said semiconductor film comprises an amorphous silicon.

50. The method of claim 46 wherein said heating is conducted at a temperature of 450 to 700°

C.

51. The method of claim 46 wherein said heating is conducted at a temperature of 800 to 1100°

C.

52. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a mask provided over said semiconductor film;

heating said semiconductor film to crystallize said semiconductor film using said crystallization promoting material and to getter said crystallization promoting material into said selected portion of said semiconductor film; and

etching said selected portion of said semiconductor film and a part of said semiconductor film covered with said mask in said introducing step after said heating to form an active layer of the semiconductor device,

wherein said part of said semiconductor film covered with said mask in said introducing step is adjacent to said selected portion.

53. The method of claim 52 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

54. The method of claim 52 wherein said semiconductor film is formed into a semiconductor island.

55. The method of claim 52 wherein said semiconductor film comprises an amorphous silicon.

56. The method of claim 52 wherein said heating is conducted at a temperature of 450 to 700°

C.

57. The method of claim 52 wherein said heating is conducted at a temperature of 800 to 1100°

C.

58. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

heating said semiconductor film to getter said crystallization promoting material into said selected portion of said semiconductor film;

forming a second mask over said semiconductor film;

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of the semiconductor device.

59. The method of claim 58 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

60. The method of claim 58 wherein said semiconductor film is formed into a semiconductor island.

61. The method of claim 58 wherein said semiconductor film comprises an amorphous silicon.

62. The method of claim 58 wherein said heating is conducted at a temperature of 450 to 700°

C.

63. The method of claim 58 wherein said heating is conducted at a temperature of 800 to 1100°

C.

64. A method according to claim 58, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.

65. A method for manufacturing a semiconductor device comprising:

forming a semiconductor film comprising silicon over a substrate;

providing said semiconductor film with a crystallization promoting material;

introducing an argon ion into a selected portion of said semiconductor film using a first mask covering a first portion of said semiconductor film provided over said semiconductor film;

heating said semiconductor film to crystallize said semiconductor film using said crystallization promoting material and to getter said crystallization promoting material into said selected portion of said semiconductor film;

forming a second mask over said semiconductor film;

etching a part of said first portion of said semiconductor film and said selected portion of said semiconductor film using said second mask after said heating to form an active layer of the semiconductor device.

66. The method of claim 65 wherein said crystallization promoting material comprises an element selected from the group consisting of Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu and Au.

67. The method of claim 65 wherein said semiconductor film is formed into a semiconductor island.

68. The method of claim 65 wherein said semiconductor film comprises an amorphous silicon.

69. The method of claim 65 wherein said heating is conducted at a temperature of 450 to 700°

C.

70. The method of claim 65 wherein said heating is conducted at a temperature of 800 to 1100°

C.

71. A method according to claim 65, wherein a width of said second mask is smaller than that of said first mask in a longer direction of said semiconductor film.