Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured

• US 6,830,806 B2
• Filed: 04/11/2002
• Issued: 12/14/2004
• Est. Priority Date: 04/12/2001
• Status: Expired due to Fees

• Current Assignee: The 323 Trust
• Original Assignee: Kreido Laboratories (Namliong SkyCosmos, Inc.)
• Inventors: Lichtenberger, Philip L., Holl, Richard A.
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US10/121,631
• Publication Number:
  US 20020148640A1
• Time in Patent Office: 978 Days
• Field of Search: 428/320.2, 428/322.2, 428/323, 428/209, 428/210
• US Class Current: 428/323
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 11/003 Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/249994 Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
• CPC Class Codes: Y10T 428/249998 Indefinite plurality of similar impregnated thin sheets [e.g., "decorative laminate" type, etc.]
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Abstract

The present invention is directed to methods for producing substrates for electric circuits, particularly ultra high frequency circuits, and electric components for mounting thereon employing for the purpose mixtures of polymers and finely powdered filler materials, the latter having specific electric characteristics, such as dielectric constant and/or resistivity. Any one substrate or component can be manufactured to have at least two body regions, and even multiple body regions, each of which has a different characteristic such as dielectric constant or resistivity. The regions can be formed separately as substrate or component preforms and thereafter placed together in a mold and united into a single body by a heating and pressing operation that at least melts polymer at the junctions to bond them together. If necessary, the heat and pressure conditions are such as to melt the polymer and force it uniformly into the interstices between the filler particles to form a strong, unitary body. The characteristics can be specifically chosen to assist in impedance matching facilitating the circuit design. Articles produced according to the methods of the invention can be made to have fixed external physical dimensions despite differences in the sizes of the operative elements therein; one of the body regions can encapsulate the other region or regions to simultaneously package them. In addition to significantly increasing ease of circuit design, the components themselves, when manufactured according to the methods of the invention, require fewer additional steps than many common prior art methods.

Claims

1. A substrate or electric component comprising a body of polymer/filler composite material and having different values of an electric characteristic in different co-planar body regions thereof, comprising:

at least a first body region having a first electric characteristic and first polymer; and

at least a second body region joined to the first region to have a boundary between them, the second body region having a second polymer and having a second electric characteristic of value different from that of the same electric characteristic of the first body region, wherein the first and second polymers of the at least first body region and the at least second body region achieve the joining of the at least first body region and said at least second body region to each other by a heating and pressing operation whereby said at least first and second body regions provide desired said first and second electric characteristics.

2. A substrate or electric component as claimed in claim 1 wherein each of said body regions has as its electric characteristic a different dielectric constant.

3. A substrate or electric component as claimed in claim 1 wherein each of said body regions has as its electric characteristic a different resistivity.

4. A substrate or electric component as claimed in claim 1, wherein multiple body regions form a pattern.

5. A substrate or electric component as claimed in claim 4, wherein multiple body regions form a nonuniform pattern.

6. A substrate or electric component as claimed in claim 1, wherein at least one of the body regions has polymer/filler material comprised of a mixture of filler materials of selected electric characteristics.

7. A substrate or electric component as claimed in claim 6, wherein polymer/filler material of the at least one body regions comprises a mixture of filler materials of selected electric characteristics and nonpolar, nonfunctionalized polymer material with at least 80% by volume of filler material.

8. A substrate or electric component as claimed in claim 1, wherein the second body region is disposed in a recess in the first body region.