×

Method to prevent electrical shorts between adjacent metal lines

  • US 6,831,016 B2
  • Filed: 05/21/2002
  • Issued: 12/14/2004
  • Est. Priority Date: 09/04/2001
  • Status: Expired due to Term
First Claim
Patent Images

1. A method to prevent electrical shorts between adjacent metal lines, comprising the steps of:

  • (a) providing a semiconductor substrate;

    (b) forming a gate oxide, a gate electrode and an etching stop layer, the etching stop layer being formed on the gate electrode;

    (c) forming a first insulating layer on the semiconductor substrate and the etching stop layer;

    (d) planarizing the first insulating layer until the etching stop layer is exposed;

    (e) forming a second insulating layer on the first insulating layer, wherein the second insulating layer has a recess portion;

    (f) selectively removing the second insulating layer and the first insulating layer to form a pair of dual damascene structures, the recess portion being located between the pair of dual damascene structures;

    (g) conformally forming a diffusion barrier layer on the second insulating layer and the recess portion;

    (h) forming a metal layer on the diffusion barrier layer to fill the pair of damascene structures;

    (i) chemical mechanical polishing the metal layer to form a metal line; and

    (l) removing the diffusion barrier layer disposed in the recess portion to expose the second insulating layer by etching.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×