Method and pattern for reducing interconnect failures
First Claim
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1. A pattern for reducing interconnect failures, the pattern for reducing interconnect failures comprising:
- a first metal layer;
a second metal layer;
a dielectric layer, between the first metal layer and the second metal layer;
a first via plug in the dielectric layer, a first end of the first via plug is connected with the first metal layer, and a second end of the first via plug is connected with the second metal layer; and
at least one first line extension, attached to the first metal layer, wherein when the first via plug is connected with a second line extension attached to the first metal layer, the first line extension and the second line extension are on the same side of the first metal layer, and the first line extension collects vacancies of the first metal layer to prevent the vacancies of the first metal layer from being accumulated at a bottom of the first via plug and then forming voids.
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Abstract
A method and a pattern for reducing interconnect failures are described. The method and pattern are used for a multilevel structure of metal/dielectric/metal. At least one assistant pattern is attached to one metal layer of the multilevel structure. A thermal stress gradient resulting from the assistant pattern can collect vacancies of the metal layer, so as to prevent stress-induced voids from generating at the bottom of a via plug which connects the two metal layers.
22 Citations
17 Claims
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1. A pattern for reducing interconnect failures, the pattern for reducing interconnect failures comprising:
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a first metal layer;
a second metal layer;
a dielectric layer, between the first metal layer and the second metal layer;
a first via plug in the dielectric layer, a first end of the first via plug is connected with the first metal layer, and a second end of the first via plug is connected with the second metal layer; and
at least one first line extension, attached to the first metal layer, wherein when the first via plug is connected with a second line extension attached to the first metal layer, the first line extension and the second line extension are on the same side of the first metal layer, and the first line extension collects vacancies of the first metal layer to prevent the vacancies of the first metal layer from being accumulated at a bottom of the first via plug and then forming voids. - View Dependent Claims (2, 3)
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4. A pattern for reducing interconnect failures, the pattern for reducing interconnect failures comprising:
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a first metal layer, having a line extension;
a second metal layer;
a dielectric layer, between the first metal layer and the second metal layer, and a via plug in the dielectric layer, a first end of the via plug is connected with the line extension, and a second end of the via plug is connected with the second metal layer, wherein the line extension having at least one turning corner between the first metal layer and the via plug, the turning corner avoids vacancies in the first metal layer being driven to a bottom of the via plug. - View Dependent Claims (5, 6, 7)
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8. In an interconnect having a first via plug to connect a first metal layer and a second metal layer, an improvement thereto comprising:
at least one first line extension, attached to the first metal layer, wherein when the first via plug is connected with a second line extension attached to the first metal layer, the first line extension and the second line extension are on the same side of the first metal layer, and the first line extension collects vacancies of the first metal layer to prevent the vacancies of the first metal layer from being accumulated at a bottom of the first via plug and then forming voids. - View Dependent Claims (9)
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10. In an interconnect having a via plug to connect a first metal layer and a line extension attached to a second metal layer, an improvement thereto comprising:
the line extension having at least one turning corner between the second metal layer and the via plug, wherein the turning corner avoids vacancies in the second metal layer being driven to a bottom of the via plug. - View Dependent Claims (11, 12)
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13. A pattern for reducing interconnect failures, the pattern for reducing interconnect failures comprising:
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a first metal layer;
a second metal layer;
a dielectric layer, between the first metal layer and the second metal layer;
a first via plug in the dielectric layer, a first end of the first via plug is connected with the first metal layer, and a second end of the first via plug is connected with the second metal layer; and
at least one second via plug in the dielectric layer, a first end of the second plug is connected with the first metal layer, wherein when the first via plug is connected to a line extension attached to the first metal layer, the first end of the second via plug is not connected to the line extension to avoid interrupting the line extension, and the second via plug collects vacancies of the first metal layer to prevent the vacancies of the first metal layer from being accumulated at a bottom of the first via plug and then forming voids. - View Dependent Claims (14, 15)
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16. In an interconnect having a first via plug to connect a first metal layer and a second metal layer, an improvement thereto comprising:
at least one second via plug in the dielectric layer, a first end of the second plug is connected with the first metal layer, wherein when the first via plug is connected to a line extension attached to the first metal layer, the first end of the second via plug is not connected to the line extension to avoid interrupting the line extension, and the second via plug collects vacancies of the first metal layer to prevent the vacancies of the first metal layer from being accumulated at a bottom of the first via plug and then forming voids. - View Dependent Claims (17)
Specification