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Backing material for micromachined ultrasonic transducer devices

  • US 6,831,394 B2
  • Filed: 12/11/2002
  • Issued: 12/14/2004
  • Est. Priority Date: 12/11/2002
  • Status: Active Grant
First Claim
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1. A micromachined ultrasonic transducer device comprising:

  • an ultrasonic transducer array micromachined on or in a substrate;

    electrical connections connected to said ultrasonic transducer array; and

    a body of acoustically attenuative material that supports said substrate and said electrical connections.

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