System and method for comparing electronics manufacturing data

• US 6,832,122 B1
• Filed: 11/17/2000
• Issued: 12/14/2004
• Est. Priority Date: 07/06/2000
• Status: Expired due to Fees

• Current Assignee: Siemens Electronics Assembly Systems LLC (ASM International NV)
• Original Assignee: Siemens Dematic Electronics Assembly Systems Incorporated
• Inventors: Huber, Robert
• Primary Examiner(s): Picard, Leo
• Assistant Examiner(s): KASENGE, CHARLES R
• Application Number:
  US09/716,018
• Time in Patent Office: 1,488 Days
• Field of Search: 700/97, 700/109, 700/121, 700/95, 700/99, 700/117, 700/91, 700/96, 702/81, 702/82, 702/83, 702/84
• US Class Current: 700/95
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A server exchange utility for exchanging manufacturing information from a number of geographically dispersed sites is provided in combination with a difference editor for comparing differences between objects representing the manufacturing information. The exchange utility stores all manufacturing information at a central location including global manufacturing information and copies of local manufacturing information for each manufacturing site. The difference editor uses a GUI to provides an organized, easy-to-read interface to the system.

Claims

1. A system for managing electronics manufacturing data comprising:

a processor;

a data storage device operably connected to the processor, the data storage device storing global manufacturing standardization data and a plurality of electronic manufacturing data sets, each of the plurality of electronic manufacturing data sets corresponding to a local manufacturing process; and

a difference editor executable on the processor to display differences between the at least one of the electronic manufacturing data sets and the global manufacturing standardization data.

2. The system of claim 1 wherein the data storage device includes a server for providing the manufacturing standardization data.

3. The system as recited in claim 2 wherein the data storage device further includes a control system for providing a first of the plurality of electronic manufacturing data sets, the processor being located at the control system.

4. The system as recited in claim 1 wherein the data storage device includes a central server for providing the manufacturing standardization data, a first control system for providing a first of the plurality of electronic manufacturing data sets, and a second control system for providing a first of the plurality of electronic manufacturing data sets.

5. A method for managing of electronics manufacturing data, in which the data comprises global data used for a plurality of assembly lines and local data used at one of the plurality of assembly lines, comprising the steps of:

permitting global electronics manufacturing data to be modified by a first set of persons;

permitting local electronics manufacturing data to be modified by a second set of persons;

displaying differences between the local electronics manufacturing data and the global electronics manufacturing data as to permit a comparison between local electronics manufacturing data and global electronic manufacturing data wherein the first and second sets of persons are not identical.

6. The method as recited in claim 5 wherein the displaying step includes displaying a graphical representation of an electronic component.

7. The method as recited in claim 5 wherein the displaying step includes highlighting the differences.

8. The method as recited in claim 5 wherein the displaying step includes displaying lead information of an electronic component.

9. The method as recited in claim 5 wherein the local electronics manufacturing data includes information regarding a length of electronic component leads.

10. The method as recited in claim 5 wherein the global electronics manufacturing data includes a specification for a length of electronic component leads.

11. A manufacturing system comprising:

a first assembly line having a first controller, the first controller containing a first set of manufacturing data related to a product manufactured by the first assembly line;

a second assembly line remote from the first assembly line and having a second controller, the second controller containing a second set of manufacturing data related to a product manufactured by the second assembly line, the products of the first and second assembly lines being similar products;

a central server providing a global standardization specification for the products to the first controller and to the second controller; and

a display displaying differences between a set of manufacturing data and the global standardization specification.

12. The manufacturing system as recited in claim 11 wherein the product is a printed circuit board.

13. The manufacturing system as recited in claim 11 wherein the display includes a first window for the first set of manufacturing data and a second window for the second set of manufacturing data.

14. The manufacturing system as recited in claim 11 wherein the first set of data includes information relating to a plurality of electric components.

15. A method for displaying differences between a first set of electronics manufacturing data and a second set of electronics manufacturing data comprising the steps of:

displaying the first set of electronics manufacturing data on a section of a display, the first set of electronics manufacturing data including a list of components being used in an assembly line;

displaying the second set of electronics manufacturing data on an other section of the display concurrently with the displayed first set of electronics manufacturing data, the second set of electronics manufacturing data including another list of component desired to be manufactured on the assembly line; and

displaying differences between the first and second set of electronics manufacturing data.

16. The method as recited in claim 15 wherein the differences are displayed through highlighting.

17. The method as recited in claim 15 wherein the assembly line is a printed circuit board assembly line.