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Method of fabricating and repairing ceramic components for semiconductor fabrication using plasma spray process

  • US 6,833,279 B2
  • Filed: 12/04/2002
  • Issued: 12/21/2004
  • Est. Priority Date: 12/07/2001
  • Status: Active Grant
First Claim
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1. A method of manufacturing and repairing a ceramic component for semiconductor fabrication, the method comprising:

  • activating a surface layer of a ceramic component, which is manufactured by sintering a ceramic, and depositing a dielectric coating layer on the surface layer of the ceramic component using a plasma spray process, wherein the step of depositing the dielectric coating layer on the surface layer of the ceramic component comprises depositing one material selected from the group consisting of alumina, zirconia, yttria, and YAG on the surface layer of the ceramic component;

    when the dielectric coating layer is damaged as the ceramic component is used for semiconductor fabrication, removing the dielectric coating layer; and

    repairing the ceramic component by depositing a dielectric coating layer on the surface layer of the ceramic component from which the damaged dielectric coating layer has been removed.

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