Flip-chip image sensor packages

• US 6,833,612 B2
• Filed: 07/03/2003
• Issued: 12/21/2004
• Est. Priority Date: 08/29/2002
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Kinsman, Larry D.
• Primary Examiner(s): Ngô , Ngân V.
• Application Number:
  US10/613,274
• Publication Number:
  US 20040041282A1
• Time in Patent Office: 537 Days
• Field of Search: 257/680, 257/682, 257/687, 257/688, 257/689, 257/695, 257/727, 257/778
• US Class Current: 257/680
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.

Claims

1. An electronic device package comprising:

a transparent substrate;

a flexible substrate having a mounting portion and a backing portion, the mounting portion having a central aperture and secured to a surface of the transparent substrate with the transparent substrate extending over the central aperture;

a plurality of conductive traces, each conductive trace of the plurality of conductive traces having a first attachment point on a first side of the flexible substrate and located substantially adjacent the central aperture of the mounting portion, and a second attachment point located on the backing portion on a second side of the flexible substrate; and

an optically interactive electronic device having at least one bond pad, the optically interactive electronic device mounted to the mounting portion of the flexible substrate by a bond between the first attachment point of a conductive trace of the plurality of conductive traces and the at least one bond pad.

2. The electronic device package of claim 1, further comprising a rigid substrate secured to the backing portion of the flexible substrate.

3. The electronic device package according to claim 1, further comprising:

a bead of sealant material contacting at least one side of the optically interactive electronic device and the first side of the flexible substrate.

4. The electronic device package according to claim 3, wherein the bead of sealant material comprises one of epoxy and silicone.

5. The electronic device package according to claim 1, wherein the backing portion of the flexible substrate is adhesively attached to a back surface of the optically interactive electronic device.

6. The electronic device package according to claim 1, further comprising:

at least one stand-off structure disposed between and adhered to the backing portion and the mounting portion of the flexible substrate.

7. The electronic device package according to claim 1, wherein the second attachment points of the plurality of conductive traces are formed in an array pattern on the backing portion on the second side of the flexible substrate.

8. The electronic device package according to claim 1, further comprising:

a discrete conductive element attached to the second attachment point of the conductive trace of the plurality of conductive traces.

9. The electronic device package according to claim 8, wherein the discrete conductive element comprises one of a solder ball, a solder column, a conductive epoxy, and a conductor-filled epoxy.

10. The electronic device package according to claim 1, wherein the optically interactive electronic device comprises an image sensor.

11. The electronic device package according to claim 1, wherein the transparent substrate comprises a single substrate having a plurality of optically interactive electronic devices mounted thereto.