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Semiconductor package

  • US 6,835,597 B2
  • Filed: 06/26/2003
  • Issued: 12/28/2004
  • Est. Priority Date: 04/27/2001
  • Status: Expired due to Term
First Claim
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1. A process of producing a semiconductor package comprising:

  • forming a plurality of pad segments forming each of plural pads to which each external connection terminal is bonded while opening up spaces between the pad segments sufficient for passing interconnections therethrough when forming an interconnection layer including interconnection patterns and the pads on an insulating substrate or insulating layer;

    forming a protective layer covering said interconnection layer other than at portions of pads formed by said plurality of pad segments and said insulating substrate or Insulating layer; and

    bonding one external connection terminal to each pad formed by said plurality of pad segments exposed from said protective layer.

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