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Packaged microelectronic components

  • US 6,836,009 B2
  • Filed: 08/28/2002
  • Issued: 12/28/2004
  • Est. Priority Date: 08/08/2002
  • Status: Active Grant
First Claim
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1. A microelectronic component package, comprising:

  • a single semiconductor die;

    an encapsulant encapsulating the semiconductor die, the encapsulant having a face and a peripheral edge;

    a plurality of electrical leads, at least some of which are electrically coupled to the semiconductor die, each of the electrical leads having an exposed length extending transversely outwardly beyond the peripheral edge of the encapsulant; and

    a plurality of terminals arranged in a first terminal array, each of the terminals being positioned proximate the face of the encapsulant and having a width different from a width of the lead.

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