Light emitting diode

• US 6,838,702 B1
• Filed: 10/10/2003
• Issued: 01/04/2005
• Est. Priority Date: 10/10/2003
• Status: Expired due to Fees

• Current Assignee: Leatec Fine Ceramics Co., Ltd.
• Original Assignee: Lambda Technologies, Inc
• Inventors: Ho, Wen-Chih
• Primary Examiner(s): Tran, Thien F
• Application Number:
  US10/682,425
• Time in Patent Office: 452 Days
• Field of Search: 257/13, 257 79-103
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light emitting chip with heat dissipating structure, which emits light as electricity flows through and is applicable as the light source for LED. The light emitting chip is composed of epitaxy chip and electrodes, and uses insulating material with good heat-dissipation to form the substrate of the emission layer. To improve the heat dissipation rate, the substrate has plural openings filled with conducting metals, so the substrate has better heat conductivity and dissipation rate.

Claims

1. A light emitting chip with a heat dissipating structure, applied in a light emitting diode (LED) as a light source, the light emitting chip comprising:

an epitaxy chip, having a lower surface attached with plural metal blocks;

a heat dissipating substrate, having an upper surface attached with a p-electrode and an n-electrode, the p-electrode and the n-electrode being positioned corresponding to the metal blocks on the epitaxy chip and being in contact with the metal blocks, the heat dissipating substrate having plural openings thereon; and

plural heat conducting cylinders with high heat dissipating characteristics, formed inside of the openings on the epitaxy chip.

2. The light emitting chip as claimed in claim 1, wherein the heat conducting cylinder is composed of In, Pd, or an alloy of In and Pd.

3. The light emitting chip as claimed in claim 1, wherein the heat dissipating substrate is a ceramic substrate.

4. The light emitting chip as claimed in claim 1, wherein the heat dissipating substrate is composed of aluminum oxides.

5. The light emitting chip as claimed in claim 1, wherein the heat dissipating substrate is composed of aluminum nitrides.

6. The light emitting chip as claimed in claim 1, wherein the heat dissipating substrate has a lower surface connected to a metal heat-dissipating layer.