Insulators for high density circuits
First Claim
Patent Images
1. An integrated circuit structure comprising:
- a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
1 Assignment
0 Petitions
Accused Products
Abstract
A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive structures are embedded in the foamed polymer layer. An insulator is formed by forming a polymer layer having a thickness on a substrate. The polymer layer is foamed to form a foamed polymer layer having a surface and a foamed polymer layer thickness, which is greater than the polymer layer thickness. The surface of the foamed polymer layer is treated to make the surface hydrophobic.
106 Citations
46 Claims
-
1. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. An integrated circuit structure comprising:
-
a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. An integrated circuit structure comprising:
-
a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer, wherein the foamed material layer has a plurality of cells with an average cell size less than about 1 micron.
-
-
14. An integrated circuit structure comprising:
-
a substrate;
a foamed material layer on the substrate, the foamed material layer having surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer, wherein the foamed material layer has a plurality of cells with an average cell size less than about 0.1 micron.
-
-
15. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed aerogel layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foam aerogel layers. - View Dependent Claims (16, 17)
-
-
18. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed polyimide layers on the substrate, each of the stacked foamed polyimide layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polyimide layers. - View Dependent Claims (19, 20)
-
-
21. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed polyimide layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers, wherein the foamed polyimide layers are foamed polyimide layers containing silane.
-
-
22. An integrated circuit structure comprising:
-
a substrate;
a plurality of electronic devices on the substrate; and
an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic. - View Dependent Claims (23, 24)
-
-
25. An integrated circuit structure comprising:
-
a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer;
the foamed material layer formed by exposing an unfoamed material layer to a supercritical fluid to form the foamed material layer. - View Dependent Claims (26, 27, 28, 29)
-
-
30. An integrated circuit structure comprising:
-
a substrate;
a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic; and
a plurality of conductive structures embedded in the foamed material layer;
the surface of the foamed material layer formed hydrophobic by exposing the surface of the foamed material layer to a plurality of methane radicals. - View Dependent Claims (31, 32)
-
-
33. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers;
the foamed polymer layers having a hydrophobic surface being formed by exposing an unfoamed polymer layer to a supercritical fluid to form the foamed polymer layer, and exposing the surface of each foamed polymer layer to a plurality of methane radicals. - View Dependent Claims (34, 35, 36)
-
-
37. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic; and
a plurality of conductive structures embedded in each of the plurality of foamed polymer layers;
the foamed polymer layers having a hydrophobic surface being formed by exposing an unfoamed polymer layer to a supercritical fluid to form the foamed polymer layer, and exposing the surface of each foamed polymer layer to a plurality of methane radicals, wherein each unfoamed polymer layer is a polymer layer containing silane.
-
-
38. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed aerogel layers having a surface that is hydrophobic;
a plurality of conductive structure embedded in each of the plurality of foamed aerogel layers; and
the foamed aerogel layers having a hydrophobic surface being formed by exposing an unfoamed aerogel layer to a supercritical fluid to form the foamed aerogel layer, and exposing the surface of each foamed aerogel layer to a plurality of methane radicals. - View Dependent Claims (39, 42)
-
-
40. An integrated circuit structure comprising:
-
a substrate;
a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed aerogel layers having a surface that is hydrophobic;
a plurality of conductive structures embedded in each of the plurality of foam aerogel layers; and
the foamed aerogel layers having a hydrophobic surface being formed by exposing an unfoamed aerogel layer to a supercritical fluid to form the foamed aerogel layer, and exposing the surface of each foamed aerogel layer to a plurality of methane radicals, wherein each foamed aerogel layer has a plurality of cells with an average cell size less than about 1 micron.
-
-
41. An integrated circuit structure comprising:
a substrate;
a plurality of electronic devices on the substrate; and
an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic;
the surface of the air-bridge structure bein made hydrophobic by exposing the surface of the air bridge structure to a plurality of methane radicals. - View Dependent Claims (43, 44, 45, 46)
Specification