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Insulators for high density circuits

  • US 6,838,764 B2
  • Filed: 06/24/2002
  • Issued: 01/04/2005
  • Est. Priority Date: 08/25/1999
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit structure comprising:

  • a substrate;

    a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron; and

    a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.

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