Probe card assembly

• US 6,838,893 B2
• Filed: 06/10/2003
• Issued: 01/04/2005
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Eldridge, Benjamin N. Jr., Khandros, Igor Y. Jr., Sporck, A. Nicholas Jr.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US10/458,875
• Publication Number:
  US 20030222667A1
• Time in Patent Office: 574 Days
• Field of Search: 324754-755, 324761-762, 324/765, 439/482, 257723-724, 297/05, 174/251, 174/254, 174/256, 174/260, 174/267, 361/764, 361/813
• US Class Current: 324/756.03
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07364 with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/45014 : Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Claims

1. A probe card assembly, comprising:

a probe card having a plurality of first contact terminals;

at least one silicon substrate having a first plurality of substrate terminals and a second plurality of substrate terminals, there being a space between said probe card and said at least one silicon substrate;

a plurality of electrical connections connecting selected ones of the plurality of first contact terminals and selected ones of the plurality of first substrate terminals;

a plurality of probe elements mounted to the second plurality of substrate terminals; and

a moveable element, wherein movement of said element controls an orientation of said silicon substrate with respect to said probe card.

2. The probe card assembly of claim 1, wherein the plurality of electrical connections are tape automated bonds.

3. The probe card assembly of claim 1, wherein the plurality of electrical connections are a flexible ribbon-like cable.

4. The probe card assembly of claim 1, wherein the plurality of electrical connections are wirebonds.

5. The probe card assembly of claim 1 further comprising a biasing element for applying a force to said at least one silicon substrate biasing the at least one silicon substrate away from the probe card.

6. The probe card assembly of claim 5, wherein said biasing element biases said silicon substrate out of contact with said probe card.

7. The probe card assembly of claim 1, wherein said moveable element is threaded.

8. The probe card assembly of claim 7, wherein said moveable element comprises a screw.

9. The probe card assembly of claim 8, wherein said screw comprises a differential screw.

10. The probe card assembly of claim 1, wherein said moveable element comprises a ball.

11. The probe card assembly of claim 1 further comprising a backing substrate, wherein said at least one silicon substrate is attached to said backing substrate.

12. The probe card assembly of claim 11, wherein said backing substrate is rigid.

13. The probe card assembly of claim 1, wherein said probe elements are elongate.

14. The probe card assembly of claim 1, wherein said probe elements are spring contacts.

15. The probe card assembly of claim 1, wherein said probe elements comprise a core material and an overcoat, and said overcoat comprises a material that is harder than said core material.

16. A probe card assembly, comprising:

a probe card having a plurality of first contact terminals;

at least one silicon substrate having a first plurality of substrate terminals and a second plurality of substrate terminals;

a plurality of electrical connections connecting selected ones of the plurality of first contact terminals and selected ones of the plurality of first substrate terminals;

a plurality of probe elements mounted to the second plurality of substrate terminals; and

a compliant element for biasing the at least one silicon substrate away from the probe card,

wherein the compliant element is at least one coil spring.

17. A probe card assembly, comprising:

a probe card having a plurality of first contact terminals;

at least one silicon substrate having a first plurality of substrate terminals and a second plurality of substrate terminals, there being a space between said probe card and said at least one silicon substrate;

a plurality of tape automated bonds connecting selected ones of the plurality of first contact terminals with selected ones of the plurality of first substrate terminals;

a plurality of probe elements mounted to the second plurality of substrate terminals;

a compliant element for biasing the at least one silicon substrate away from the probe card; and

a moveable element, wherein movement of said element controls an orientation of said silicon substrate with respect to said probe card.

18. The probe card assembly of claim 17, wherein said compliant element biases said the at least one silicon substrate away from the probe card by applying a force against said at least one silicon substrate.

19. A probe card assembly comprising:

a probe card;

at least one silicon substrate, there being a space between said silicon substrate and said probe card;

a compliant element electrically connecting said at least one silicon substrate with said probe card;

a plurality of probe elements disposed on said silicon substrate; and

a moveable element, wherein movement of said element controls an orientation of said silicon substrate with respect to said probe card.