Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
First Claim
1. A system for probing integrated, circuits comprising:
- a chamber including;
at least a module having a holding fixture, a temperature control device, a substrate probing device, a gas source, and a handler, said holding fixture adapted to hold a substrate having integrated circuits, each of said integrated circuits having a plurality of conductive contact portions, said plurality of conductive contact portions for coupling to probe points of said probing device, said temperature control device for modifying the temperature of said substrate, said gas source for supplying at least a non-oxidizing gas into said module, said handler for moving said substrate;
wherein, to reduce the thickness of oxides on said plurality of conductive contact portions of said substrate, said temperature control device modifies the temperature of said substrate, and said gas source provides hydrogen over said oxides.
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Abstract
A single gas tight system may perform multi-functions including reducing the thickness of oxides on contact pads and probing, testing, burn-in, repairing, programming and binning of integrated circuits. A holding fixture holds a wafer having integrated circuits and aligns the wafer to a full-substrate probing device. A temperature control device is used to heat the wafer during an oxide reduction process or during burn-in of the wafer. During the oxide reduction process, hydrogen is introduced into the chamber, and the wafer is heated so that the oxides on the contact pads can combine with hydrogen to form water vapor, thus reducing the thickness of the oxides. A computer analyzes the test and/or burn-in data and provides control signals for repairing or programming the integrated circuits.
134 Citations
18 Claims
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1. A system for probing integrated, circuits comprising:
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a chamber including;
at least a module having a holding fixture, a temperature control device, a substrate probing device, a gas source, and a handler, said holding fixture adapted to hold a substrate having integrated circuits, each of said integrated circuits having a plurality of conductive contact portions, said plurality of conductive contact portions for coupling to probe points of said probing device, said temperature control device for modifying the temperature of said substrate, said gas source for supplying at least a non-oxidizing gas into said module, said handler for moving said substrate;
wherein, to reduce the thickness of oxides on said plurality of conductive contact portions of said substrate, said temperature control device modifies the temperature of said substrate, and said gas source provides hydrogen over said oxides. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A system for probing integrated circuits comprising:
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a chamber including;
at least a module having a holding fixture, a temperature control device, a substrate probing device, a gas source, and a handler, said holding fixture adapted to hold a substrate having integrated circuits, each of said integrated circuits having a plurality of conductive contact portions, said plurality of conductive contract portions coupling to probe points of said probing device, said temperature control device adapted to control the temperature of said substrate, said gas source adapted to supply at least a non-oxidizing gas into said module, said handler adapted to move said substrate;
wherein said temperature control device controls the temperature of said substrate, and said gas source provides hydrogen thereby to reduce the thickness of oxides an said plurality of conductive contact portions. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A system for probing integrated circuits comprising:
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a holding fixture, a temperature control device, and a probing device, wherein said holding fixture is adapted to hold a substrate having a plurality of integrated circuits, each of said integrated circuits having a plurality of contact points, said probing device having a plurality of probe points adapted to contact simultaneously substantially all of said plurality of contact portions of substantially all of said integrated circuits, and wherein said temperature control device is adapted to control the temperature of said substrate; and
a gas source adapted to supply at least hydrogen gas into said system thereby to reduce the thickness of oxides on said plurality of contact portions. - View Dependent Claims (15, 16, 17, 18)
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Specification