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Thinned die integrated circuit package

  • US 6,841,413 B2
  • Filed: 01/07/2002
  • Issued: 01/11/2005
  • Est. Priority Date: 01/07/2002
  • Status: Active Grant
First Claim
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1. A method of fabricating an integrated circuit package, comprising:

  • mounting a thinned semiconductor die on a planar surface of a heat spreader, wherein mounting includes attaching said die to the heat spreader by metal to metal diffusion bonding.

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