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Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate

  • US 6,841,415 B2
  • Filed: 04/13/2001
  • Issued: 01/11/2005
  • Est. Priority Date: 04/14/2000
  • Status: Active Grant
First Claim
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1. A flip chip mounting method in which a semiconductor chip having a bump is pressed against a substrate so that the bump of the semiconductor chip faces the substrate or a semiconductor chip having no bump is pressed against a substrate having a bump on the surface and/or having a finely uneven surface due to a wiring pattern to seal up the gap between the semiconductor chip and the substrate using an underfill, the method comprising the steps of:

  • (A) drying the substrate; and

    (B) dispensing uncured underfill at least at an entire portion of a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and

    (C) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate 200°

    K or lower.

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