Patch

• US 6,841,716 B1
• Filed: 04/27/2000
• Issued: 01/11/2005
• Est. Priority Date: 05/13/1999
• Status: Expired due to Term

• Current Assignee: Hisamitsu Pharmaceutical Company Incorporated
• Original Assignee: Hisamitsu Pharmaceutical Company Incorporated
• Inventors: Tsutsumi, Nobuo
• Primary Examiner(s): Lewis, Kim M.
• Application Number:
  US09/959,928
• Time in Patent Office: 1,720 Days
• Field of Search: 602 41- 59, 206/440, 206/441, 129/888, 129/889, D24/189, 604304-308, 424443-449
• US Class Current: 602/57
• CPC Class Codes: A61F 13/0256 characterized by the parametric properties of the adhesive
• CPC Class Codes: A61F 13/0259 characterised by the release liner covering the skin adhering layer
• CPC Class Codes: A61F 2013/008 easy removing of the protection sheet
• CPC Class Codes: A61K 9/703 characterised by shape or structure; Details concerning release liner or backing; Refillable patches; User-activated patches
• CPC Class Codes: A61K 9/7038 Transdermal patches of the drug-in-adhesive type, i.e. comprising drug in the skin-adhesive layer
• CPC Class Codes: A61P 23/00 Anaesthetics

Abstract

According to the invention, a patch provided with a support 1, an adhesive layer 2 laminated on one side of the support, and a release film 4 attached in a releasable manner to the adhesive layer and having a slit 42 running from one edge to the opposite edge, is characterized in that the shape of the slit in the release film is a wave shape such that, by simply bending the support slightly along the slit while the exposed side of the adhesive layer which has been exposed by peeling off part of the release film along the slit is attached to the attachment site, the edge 44 of the slit of the remaining release film can promptly protrude outward from between the attachment site and the adhesive layer.

Claims

1. A patch provided with a support, an adhesive layer laminated on one side of said support, and a release film attached in a releasable manner to said adhesive layer and having a slit running from one edge to the opposite edge, the patch being characterized in that

the shape of the slit in said release film is a wave shape such that,

by simply bending said support slightly along said slit while the exposed side of said adhesive layer which has been exposed by peeling off part of said release film along said slit is attached to the attachment site, the edge of said slit of the remaining release film can promptly protrude outward from between the attachment site and said adhesive layer, the wave pitch of said wave-shaped slit of said release film is 6 mm to 12.5 mm, and the wave height of each said wave-shaped slit of said release film is 4 mm to 8 mm.

2. The patch according to claim 1, wherein two said wave-shaped slits are provided in said release film, and the two said slits are substantially parallel to each other.

3. The patch according to claim 2, wherein the spacing between the two wave-shaped slits of said release film is 20 mm to 30 mm.

4. The patch according to claim 1, wherein the wave height of said wave-shaped slit of said release film is 6 mm to 7 mm.

5. The patch according to claim 1, wherein said patch has corners, said corners are rounded so as to have a curvature radius of at least 5 mm.

6. The patch according to claim 1, wherein said adhesive layer is from 10 μ

m to 400 μ

m thick.

7. The patch according to claim 1, wherein said support is from 0.01 to 5 mm thick.

8. The patch according to claim 1, wherein the spacing between the two wave-shaped slits of said release film is 20 mm to 30 mm, the wave height of said wave-shaped slit of said release film is 6 mm to 7 mm, said patch has corners, said corners are rounded so as to have a curvature radius of at least 5 mm, said adhesive layer is from 10 μ

m to 400 μ

m thick, and said support is from 0.01 to 5 mm thick.