Substrate mapping

• US 6,841,796 B2
• Filed: 10/25/2002
• Issued: 01/11/2005
• Est. Priority Date: 08/22/2001
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farnworth, Warren M., Gochnour, Derek J.
• Primary Examiner(s): Zarneke, David A.
• Application Number:
  US10/280,200
• Publication Number:
  US 20030046810A1
• Time in Patent Office: 809 Days
• Field of Search: 294/070.1, 294/070.9, 297/05, 297/10, 297/11, 297/40, 297/42, 438 14- 18, 257/48, 228103-105, 228/4.1, 228/5.1, 228/6.2, 228/7.9, 156/64, 156/249, 156/344, 156/378, 156/584
• US Class Current: 257/48
• CPC Class Codes: H01L 2223/54413 comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/53043 including means to divert defective work part
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus

Abstract

A method and apparatus relating to fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having substrate identification information. The die attach sites are evaluated and categorized as either good or defective die attach sites, wherein the evaluated information is saved in an electronic file as mapped information. A die attach apparatus attaches dice to the die attach sites in accord with the mapped information, wherein known good dice are attached to the good die attach sites and known defective dice are attached to the defective die attach sites. The assembly is then encapsulated in a transfer molding operation.

Claims

1. A system for assembling a semiconductor package, the system comprising:

a mounting substrate having a plurality of die attach sites on at least one surface thereof, said substrate configured with a designator having encoded information thereon;

a reading unit coupled to an electronic file associated with said encoded information, said electronic file having mapped information of said mounting substrate, said mapped information including locations on said mounting substrate of good die attach sites and defective die attach sites;

an attachment apparatus coupled to said reading unit and said electronic file, at least one of said reading unit and said electronic file providing said mapped information to said attachment apparatus, said attachment apparatus selectively attaching good dice to said good die attach sites and selectively attaching defective dice to said defective die attach sites in accord with said mapped information.

2. The system of claim 1, further comprising a wafer testing station configured to download wafer information to said electronic file.

3. The system of claim 2, wherein said attachment apparatus is configured to receive said wafer information to selectively pick said defective dice and said good dice for attaching to said defective die attach sites and said good die attach sites, respectively.

4. The system of claim 1, further comprising a substrate testing station configured to test said mounting substrate and provide said mapped information of said mounting substrate.

5. The system of claim 1, further comprising a molding station configured to provide an encapsulant over each of said good dice and said defective dice.

6. The system of claim 5, wherein said molding station includes a transfer molding apparatus.

7. The system of claim 1, further comprising a segregation station configured to segregate said plurality of die attach sites, each having a die attached thereon, into individual semiconductor die packages.

8. The system of claim 7, wherein said segregation station includes another reading unit coupled to said electronic file having said mapped information, said segregation station configured to discard said individual semiconductor die packages having said defective dice attached to said defective die attach sites.

9. A system for fabricating semiconductor packages, the system comprising:

a substrate testing station configured to test a mounting substrate having a plurality of die attach sites and configured to provide mapped information of said mounting substrate to an electronic file associated with a designator on said substrate, said mapped information including locations on said mounting substrate of good die attach sites and defective die attach sites;

a die attach station coupled to said electronic file and configured to attach good dice to said good die attach sites and attach defective dice to said defective die attach sites in accord with said mapped information in said electronic file;

a molding station configured to provide encapsulant material to said mounting substrate and encapsulate each of said good dice and said defective dice, each attached to said good die attach sites and said defective die attach sites, respectively; and

a segregation station coupled to said electronic file and configured to segregate said plurality of die attach sites, each having a die attached thereon, into individual semiconductor die packages.

10. The system of claim 9, further comprising a wafer testing station configured to test semiconductor wafers and provide wafer map information to said electronic file.

11. The system of claim 10, wherein said wafer map information comprises locations of each of good dice and defective dice from said semiconductor wafers.

12. The system of claim 9, wherein said substrate testing station is configured to provide a designator having identification information to a peripheral portion of said mounting substrate.

13. The system of claim 12, wherein said mapped information in said electronic file is accessed by said identification information on said designator.

14. The system of claim 13, wherein said die attach station comprises a reading unit coupled to a die attach apparatus, said reading unit configured to read said designator for accessing said mapped information so that said die attach apparatus attaches said good dice to said good die attach sites and attaches said defective dice to said defective die attach sites in accord with said mapped information in said electronic file.

15. The system of claim 9, wherein said molding station comprises a transfer molding apparatus.

16. The system of claim 12, wherein said segregation station comprises a reading unit configured to read said designator for accessing said mapped information, said segregation station configured to discard said individual semiconductor die packages having said defective dice attached to said defective die attach sites in accord with said mapped information.

17. An apparatus for assembling a semiconductor package having a mounting substrate having a plurality of die attach sites on at least one surface thereof, said mounting substrate configured with a designator having encoded information thereon, said apparatus comprising:

a reading unit coupled to an electronic file associated with said encoded information,

said electronic file having mapped information of said mounting substrate, said mapped information including locations on said mounting substrate of good die attach sites and defective die attach sites;

an attachment apparatus coupled to said reading unit and said electronic file, at least one of said reading unit and said electronic file providing said mapped information to said attachment apparatus, said attachment apparatus selectively attaching good dice to said good die attach sites and selectively attaching defective dice to said defective die attach sites in accord with said mapped information.

18. The apparatus of claim 17, further comprising a wafer testing station configured to download wafer information to said electronic file.

19. The apparatus of claim 18, wherein said attachment apparatus is configured to receive said wafer information to selectively pick said defective dice and said good dice for attaching to said defective die attach sites and said good die attach sites, respectively.

20. The apparatus of claim 17, further comprising a substrate testing station configured to test said mounting substrate and provide said mapped information of said mounting substrate.

21. The apparatus of claim 17, further comprising a molding station configured to provide an encapsulant over each of said good dice and said defective dice.

22. The apparatus of claim 21, wherein said molding station includes a transfer molding apparatus.

23. The apparatus of claim 17, further comprising a segregation station configured to segregate said plurality of die attach sites, each having a die attached thereon, into individual semiconductor die packages.

24. The apparatus of claim 23, wherein said segregation station includes another reading unit coupled to said electronic file having said mapped information, said segregation station configured to discard said individual semiconductor die packages having said defective dice attached to said defective die attach sites.