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Semiconductor package and fabrication method thereof

  • US 6,841,872 B1
  • Filed: 11/13/2000
  • Issued: 01/11/2005
  • Est. Priority Date: 01/05/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor package, comprising:

  • a semiconductor substrate;

    a plurality of chip pads separately formed on an upper surface of the semiconductor substrate;

    a first metal pattern formed on an upper surface of respective chip pads;

    a second metal pattern formed on an upper surface of the first metal pattern and having a plurality of bulkheads separately formed on the first metal pattern, wherein a width of the bulkhead is uniform regardless of a height of the bulkhead; and

    an external terminal electrically connected to an upper surface of the second metal pattern and a side portion of the bulkhead and extending into a space between the plurality of bulkheads.

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