Elastomer interposer for grid array packages and method of manufacturing the same

• US 6,841,882 B2
• Filed: 11/14/2002
• Issued: 01/11/2005
• Est. Priority Date: 02/07/2002
• Status: Active Grant

• Current Assignee: VIA Technologies Incorporated (VIA Technologies)
• Original Assignee: VIA Technologies Incorporated (VIA Technologies)
• Inventors: Chien, Ray
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): POMPEY, RON EVERETT
• Application Number:
  US10/293,564
• Publication Number:
  US 20030146510A1
• Time in Patent Office: 789 Days
• Field of Search: 257/777, 257/E23.001, 439/66, 439/71, 439/91, 439/591, 361/719, 324/767, 324/757, 298/30, 298/52
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15183 in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 2201/0133 : Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/09836 : Oblique hole, via or bump
• CPC Class Codes: H05K 2201/10287 : Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2203/0235 : Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/4038 : Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

Claims

1. An elastomer interposer, employed between a package and a printed circuit board, comprising:

an elastomer, having a first surface and a second surface;

a plurality of conductive wires, arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;

a plurality of first Cu pads, formed on the first surface at a space and electrically connected to the corresponding conductive wires;

a plurality of second Cu pads, formed on the second surface at the space and electrically connected to the corresponding conductive wires;

a plurality of first solder resistant blocks, having openings surrounding the first Cu pads, are on the first surface;

a plurality of second solder resistant blocks, having openings surrounding the second Cu pads, are on the second surface;

a plurality of first Ni/Au plated pads, formed on outer surface of the first Cu pads; and

a plurality of second Ni/Au plated pads, formed on outer surface of the second Cu pads.

2. The elastomer interposer according to claim 1 further comprises a plurality of first conductive bumps attached to the first Ni/Au plated pads.

3. The elastomer interposer according to claim 2, wherein the elastomer interposer is electrically connected to the PCB by contacting with the first conductive bumps.

4. The elastomer interposer according to claim 3, wherein the package is a ball grid array (BGA) package, and electrically connected to the elastomer interposer by soldering a plurality of first solder balls onto the second Ni/Au plated pads.

5. The elastomer interposer according to claim 3, wherein the package is a column grid array (CGA) package, and electrically connected to the elastomer interposer by soldering a plurality of first metal rods onto the second Ni/Au plated pads.

6. The elastomer interposer according to claim 2, wherein the package is a first land grid array (LGA) package, and electrically connected to the elastomer interposer by contacting with the first conductive bumps.

7. The elastomer interposer according to claim 6, wherein a plurality of third solder balls attached to the second Ni/Au plated pads are soldered to the PCB pads, so as to achieve the electrical connection between the elastomer interposer and PCB.

8. The elastomer interposer according to claim 2 further comprises a plurality of second conductive bumps attached to the second Ni/Au plated pads.

9. The elastomer interposer according to claim 8, wherein the package is a second land grid array (LGA) package, and electrically connected to the elastomer interposer by contacting the first conductive bumps.

10. The elastomer interposer according to claim 8, wherein the elastomer interposer is electrically connected to the PCB by contacting the second conductive bumps with the PCB pads.

11. The elastomer interposer according to claim 1 further comprises a plurality of fourth solder balls attached to the first Ni/Au plated pads.

12. The elastomer interposer according to claim 11, wherein the elastomer interposer is electrically connected to PCB by soldering the fourth solder balls onto the PCB pads.

13. The elastomer interposer according to claim 12, wherein the package is a ceramic ball grid array (CBGA) package, and electrically connected to the elastomer interposer by soldering a plurality of fifth solder balls onto the second Ni/Au plated pads.

14. The elastomer interposer according to claim 13, wherein coefficient of thermal expansion (CTE) of the CBGA package is approximately 8 ppm/°

C., and CTE of the PCB is approximately 18 ppm/°

C.

15. The elastomer interposer according to claim 12, wherein the package is a plastic ball grid array (PBGA) package, and electrically connected to the elastomer interposer by soldering a plurality of sixth solder balls onto the second Ni/Au plated pads.

16. The elastomer interposer according to claim 15, wherein CTE of the PBGA package is approximately 18 ppm/°

C., and CTE of the PCB is approximately 5˜

10 ppm/°

C.

17. The elastomer interposer according to claim 1, wherein the material of the elastomer is selected from the group consisting of silicon rubber compound, polyurethane compound, polyethylene compound, synthetic rubber, polysiloxane resin compound, acrylic compound and polyolefins compound.