Multi-dice chip scale semiconductor components and wafer level methods of fabrication
First Claim
1. A semiconductor component comprising:
- a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate;
a thinned secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias; and
a plurality of terminal contacts on the base die in electrical communication with the conductive vias.
2 Assignments
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Accused Products
Abstract
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.
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Citations
71 Claims
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1. A semiconductor component comprising:
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a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate;
a thinned secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias; and
a plurality of terminal contacts on the base die in electrical communication with the conductive vias.
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2. A semiconductor component comprising:
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a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate;
a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias;
a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
an encapsulant on the back side at least partially encapsulating the secondary die.
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3. A semiconductor component comprising:
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a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate;
a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias;
a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
a polymer layer on the base die configured as a protective member, a rigidifying member and a stencil for forming the terminal contacts. - View Dependent Claims (4)
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5. A semiconductor component comprising:
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a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate;
a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias; and
a plurality of terminal contacts on the base die in electrical communication with the conductive vias;
the base die and the secondary die comprising thinned dice. - View Dependent Claims (6)
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7. A semiconductor component comprising:
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a thinned base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a thinned secondary die stacked on the base die and bonded to the contacts; and
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A semiconductor component comprising:
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a base die comprising a thinned semiconductor substrate and a plurality of conductors on the substrate;
an internal signal transmission system comprising a plurality of conductive vias in the substrate in electrical communication with the conductors, and a plurality of contacts on the conductive vias;
a secondary die bonded to the contacts; and
a plurality of terminal contacts on the conductors. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A semiconductor component comprising:
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a base die comprising a thinned semiconductor substrate having a peripheral outline, a circuit side, a back side, and a plurality of conductive vias in the substrate;
a thinned secondary die bonded to the back side and comprising a plurality of integrated circuits in electrical communication with the conductive vias;
an encapsulant on the back side having the peripheral outline and at least partially encapsulating the secondary die;
a polymer layer on the circuit side having the peripheral outline and configured as a protective and rigidifying member for the component; and
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias. - View Dependent Claims (24, 25, 26)
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27. A semiconductor component comprising:
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a base die comprising a thinned semiconductor substrate having a peripheral outline, a circuit side, a back side, and a plurality of conductive vias in the substrate;
a thinned secondary die bonded to the back side and comprising a plurality of integrated circuits in electrical communication with the conductive vias;
an encapsulant on the back side having the peripheral outline and at least partially encapsulating the secondary die;
a polymer layer on the circuit side having the peripheral outline and configured as a protective and rigidifying member for the component;
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias; and
a second secondary die bonded to the thinned secondary die in electrical communication with the conductive vias.
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28. A semiconductor component comprising:
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a first base die comprising a plurality of first conductive vias;
a second base die stacked and bonded to the first base die comprising a plurality of second conductive vias in electrical communication with the first conductive vias;
a secondary die stacked and bonded to the second base die comprising a plurality of bumped contacts bonded to the second conductive vias; and
a plurality of terminal contacts on the first base die in electrical communication with the first conductive vias, with either the first base die, the second base die or the secondary die comprising a thinned die. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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35. A semiconductor component comprising:
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a base die comprising a semiconductor substrate having a circuit side and a back side, a plurality of die contacts on the circuit side, a plurality of conductive vias in the substrate in electrical communication with the die contacts, a plurality of redistribution conductors on the circuit side in electrical communication with the conductive vias, and a plurality of terminal contacts on the circuit side in electrical communication with the conductors;
a secondary die bonded to the back side;
an underfill layer bonding the secondary die to the base die; and
a plurality of bumped contacts bonded to the conductive vias and to the secondary die. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 49, 50)
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45. A semiconductor component comprising:
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a base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a first secondary die stacked on the base die and bonded to the contacts, the first secondary die comprising a plurality of secondary conductive vias and a plurality of secondary contacts in electrical communication with the secondary conductive vias;
a second secondary die stacked on the first secondary die and bonded to the secondary contacts;
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias; and
a polymer layer on the circuit side configured as a stencil for the terminal contacts.
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46. A semiconductor component comprising:
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a base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a first secondary die stacked on the base die and bonded to the contacts, the first secondary die comprising a plurality of secondary conductive vias and a plurality of secondary contacts in electrical communication with the secondary conductive vias;
a second secondary die stacked on the first secondary die and bonded to the secondary contacts;
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias; and
an encapsulant on the back side at least partially encapsulating the first secondary die and the second secondary die.
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47. A semiconductor component comprising:
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a base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a first secondary die stacked on the base die and bonded to the contacts, the first secondary die comprising a plurality of secondary conductive vias and a plurality of secondary contacts in electrical communication with the secondary conductive vias;
a second secondary die stacked on the first secondary die and bonded to the secondary contacts;
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias; and
a polymer layer on the circuit side configured as a rigidifying member, a protective member, and a stencil for forming the terminal contacts.
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48. A semiconductor component comprising:
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a base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a first secondary die stacked on the base die and bonded to the contacts, the first secondary die comprising a plurality of secondary conductive vias and a plurality of secondary contacts in electrical communication with the secondary conductive vias;
a second secondary die stacked on the first secondary die and bonded to the secondary contacts; and
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias;
the base die, the first secondary die and the second secondary die comprising thinned dice.
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51. A system comprising:
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a substrate; and
a semiconductor component on the substrate comprising a base die comprising a thinned substrate having a back side, and a plurality of conductive vias in the substrate, a thinned secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias, and a plurality of terminal contacts on the base die in electrical communication with the conductive vias.
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52. A system comprising:
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a substrate;
a semiconductor component on the substrate comprising a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate, a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias, and a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
a cap plate bonded to the secondary die configured to short selected contacts on the base die to selected contacts on the secondary die.
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53. A system comprising:
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a substrate; and
a semiconductor component on the substrate comprising a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate, a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias, and a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
a cap plate bonded to the secondary die and at least one electrical element on the cap plate in electrical communication with the secondary die. - View Dependent Claims (54)
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55. A system comprising:
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a substrate;
a semiconductor component on the substrate comprising a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate, a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias, and a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
an encapsulant on the back side at least partially encapsulating the secondary die.
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56. A system comprising:
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a substrate;
a semiconductor component on the substrate comprising a base die comprising a substrate having a back side, and a plurality of conductive vias in the substrate, a secondary die having a circuit side bonded to the back side and a plurality of contacts bonded to the conductive vias, and a plurality of terminal contacts on the base die in electrical communication with the conductive vias; and
a polymer layer on the base die configured as a protective member, a rigidifying member and a stencil for forming the terminal contacts.
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57. A system comprising:
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a substrate comprising a plurality of electrodes; and
a semiconductor component on the substrate comprising;
a thinned base die comprising a circuit side, a back side, a plurality of conductive vias and a plurality of contacts on the back side in electrical communication with the conductive vias;
a thinned secondary die stacked on the base die and bonded to the contacts; and
a plurality of terminal contacts on the circuit side in electrical communication with the conductive vias and bonded to the electrodes. - View Dependent Claims (58, 59, 60)
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61. A system comprising:
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a substrate comprising a plurality of electrodes;
a semiconductor component on the substrate comprising;
a base die comprising a thinned substrate having a peripheral outline and a plurality of conductive vias in the substrate;
a thinned secondary die comprising a plurality of bumped contacts bonded to the conductive vias and electrically connecting the base die and the secondary die;
an encapsulant on the base die having the peripheral outline and at least partially encapsulating the secondary die;
a rigidifying polymer layer on the base die having the peripheral outline; and
a plurality of terminal contacts on the base die proximate to the polymer layer in electrical communication with the conductive vias and bonded to the electrodes. - View Dependent Claims (62, 63, 64, 65, 66, 67, 68, 69, 70, 71)
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Specification