Exposure apparatus and exposure method, and device manufacturing method
First Claim
1. An exposure apparatus that transfers a pattern of a mask onto a substrate by irradiating said mask with exposure light, the exposure apparatus comprising:
- a sealed mask room that covers at least an optical path near said mask of the optical path of said mask to said substrate and that is filled with gas having a characteristic of absorbing little of said exposure light;
a sealed mask-reserve room, which temporarily contains said mask before being carried into said mask room, with at least one door through which said mask is transported;
a gas-replacement system connected to said mask-reserve room that supplies a specific gas to said mask-reserve room; and
a mask cleaning system that removes materials having absorption for exposure light and existing around said mask in said mask-reserve room.
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Accused Products
Abstract
After a mask is carried into a reserve room for temporarily storing before carrying into a mask room filled with specific gas that has an impurity concentration lower than a first concentration (e.g. 1 ppb) and that has a characteristic of absorbing little exposure light, gas-replacement mechanisms replace gas in the reserve room with specific gas having an oxygen concentration not lower than the first concentration. Therefore, when subsequently carrying the mask into the mask room, impurities from the outside (including absorbent gas) can be substantially prevented from getting into the optical path inside the mask room. When replacing a wafer, gas in a reserve room is also replaced in the same way as the above.
146 Citations
41 Claims
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1. An exposure apparatus that transfers a pattern of a mask onto a substrate by irradiating said mask with exposure light, the exposure apparatus comprising:
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a sealed mask room that covers at least an optical path near said mask of the optical path of said mask to said substrate and that is filled with gas having a characteristic of absorbing little of said exposure light;
a sealed mask-reserve room, which temporarily contains said mask before being carried into said mask room, with at least one door through which said mask is transported;
a gas-replacement system connected to said mask-reserve room that supplies a specific gas to said mask-reserve room; and
a mask cleaning system that removes materials having absorption for exposure light and existing around said mask in said mask-reserve room. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An exposure apparatus that transfers a pattern of a mask onto a substrate by irradiating said mask with exposure light, the exposure apparatus comprising:
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a sealed mask room that covers at least an optical path near said mask of the optical path of said mask to said substrate and that is filled with gas having a characteristic of absorbing little of said exposure light;
a sealed mask-reserve room, which temporarily contains said mask before being carried into said mask room, with at least one door through which said mask is transported;
a gas-replacement system connected to said mask-reserve room that supplies a specific gas to said mask-reserve room; and
a removing system connected to said mask-reserve room that removes materials having absorption for exposure light and existing around said mask. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. An exposure method that transfers a pattern of a mask onto a substrate by irradiating said mask with exposure light, the exposure method comprising:
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filling a sealed space that covers at least an optical path near said mask of the optical path of said exposure light from said mask to said substrate with gas having a characteristic of absorbing little of said exposure light;
temporarily storing said mask in a reserve room before carrying said mask into said sealed space;
replacing gas in said reserve room, in which said mask is existing, with said low absorbent gas, and cleaning said mask in said reserve room to remove materials having absorption for exposure light and existing around said mask; and
transporting said mask to a predetermined position in said sealed space and transferring said pattern onto said substrate. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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32. An exposure method that transfers a pattern of a mask onto a substrate by irradiating said mask with exposure light, the exposure method comprising:
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filling a sealed space that covers at least an optical path near said mask of the optical path of said exposure light from said mask to said substrate with gas having a characteristic of absorbing little of said exposure light;
temporarily storing said mask in a reserve room before carrying said mask into said sealed space;
replacing gas in said reserve room, in which said mask is existing, with said low absorbent gas;
removing materials having absorption for exposure light and existing around said mask in said mask-reserve room; and
transporting said mask to a predetermined position in said sealed space and transferring said pattern onto said substrate. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification