×

Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication

  • US 6,842,657 B1
  • Filed: 07/21/2000
  • Issued: 01/11/2005
  • Est. Priority Date: 04/09/1999
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of manufacturing a semiconductor device comprising the steps of:

  • a) providing an organic semiconductor layer;

    b) depositing a reactive species on a portion of the organic semiconductor layer; and

    c) reacting the reactive species with the portion of the organic layer to form a dielectric layer.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×