Implantable electrical cable and method of making

• US 6,843,870 B1
• Filed: 07/22/2003
• Issued: 01/18/2005
• Est. Priority Date: 07/22/2003
• Status: Expired due to Term

• Current Assignee: MED-EL Elektromedizinische Gerate GmbH (MED-EL Corporation)
• Original Assignee: Epic Biosonics Inc.
• Inventors: Bluger, Henry
• Primary Examiner(s): CORCORAN, GLADYS JOSEFINA-PIA
• Application Number:
  US10/623,639
• Publication Number:
  US 20050016657A1
• Time in Patent Office: 546 Days
• Field of Search: 156/47, 156/50, 156/51, 156/52, 156/53, 156/54, 156/55, 156/56, 156/89.12, 156/205, 156/206, 156/267, 156/268, 156/272.2, 156/272.6, 174/117.F, 174/117.FF, 174/110.AR, 174/110.S, 174/126.3, 174/110.FC, 174/98, 174/106.D, 174/102.D, 174/120.AR, 174/120.SR, 174/110.SR, 174/129.R, 174/133.R
• US Class Current: 156/50
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: H01B 13/0009 for forming corrugations on conductors or cables
• CPC Class Codes: H01B 13/0013 for embedding wires in plastic layers
• CPC Class Codes: Y10T 156/1018 Subsequent to assembly of laminae

Abstract

The present invention is an implantable cable and a process to manufacture said implantable cable. The cable is composed of a biocompatible fluoropolymer, in which biocompatible conductor wires are embedded. The entire cable is heat treated at various stages to ensure the wires are securely embedded. The cable is then undulated to enhance its pliability and flexibility. Further treatment activates the outer surface of the cable, following which it may be encapsulated in silicone.

Claims

1. A process to manufacture an implantable cable, said process comprising the steps of:

establishing a plurality of grooves on a first fluoropolymer film layer;

positioning biocompatible conductor wires into one or more of said grooves;

applying heat to confine said wires into said grooves;

depositing a second fluoropolymer layer on said first fluoropolymer film layer with said confined wires to form a first structure;

creating a second structure with outer surfaces by encapsulating said confined wires with said first and second fluoropolymer layers in said first structure through application of heat;

undulating said second structure;

activating said outer surfaces of the said second structure to form a final structure; and

encapsulating said final structure with silicone to form said implantable cable.

2. The process of claim 1, wherein said first and second fluoropolymer film layers are comprised of FEP or PFA.

3. The process of claim 1, wherein said conductor wires are comprised of Pt or Pt/Ir.

4. The process of claim 1, wherein the first and second fluoropolymer layers are removed from an end portion of said implantable cable to partially expose one or more conductor wires.

5. The process of claim 4, wherein said removed first and second fluoropolymer layers from said end portion are removed through laser cutting.

6. The process of claim 3, wherein said conductor wires have round, oval or rectangular cross sections.