Split-fabrication for light emitting display structures

• US 6,844,673 B1
• Filed: 12/06/2001
• Issued: 01/18/2005
• Est. Priority Date: 12/06/2001
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Bernkopf, Jan
• Primary Examiner(s): Patel, Vip
• Assistant Examiner(s): Perry, Anthony T.
• Application Number:
  US10/020,385
• Time in Patent Office: 1,139 Days
• Field of Search: 313/511, 313/512, 313/500, 313/505, 313/498, 313/506, 445 24- 25
• US Class Current: 313/506
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01084 Polonium [Po]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H10K 59/1275 Electrical connections of the two substrates
• CPC Class Codes: H10K 59/129 Chiplets

Abstract

Methods and apparatuses for fabricating an electroluminescent display structure. A method including coupling a frontplane to a backplane wherein a frontplane top surface laminates to a backplane top surface. The frontplane and the backplane are fabricated separately. A first electrode layer which is transparent is disposed over the frontplane. A display medium which produces electro-optical effects upon a voltage application is disposed over the first electrode. A second electrode layer which is pattered is disposed over the display medium. The second electrode layer includes a plurality of connecting regions. The backplane is electrically active to provide driving signals for the display medium wherein the backplane includes a plurality of output pads to match the plurality of connecting regions.

Claims

1. A method of fabricating a display structure comprising:

coupling a frontplane to a backplane wherein a frontplane top surface laminates to a backplane top surface, said frontplane and said backplane are fabricated separately, said frontplane further includes a frontplane substrate and said backplane further includes a backplane substrate, wherein;

a first electrode layer which is transparent is disposed over said frontplane substrate;

a display medium which produces electro-optical effects upon a voltage application is disposed over said first electrode;

a second electrode layer which is patterned is disposed over said display medium, said second electrode layer includes a plurality of connecting regions; and

said backplane is electrically active to provide driving signals for said display medium wherein said backplane substrate includes a plurality of output pads to match said plurality of connecting regions;

coating said plurality of output pads with an insulation layer having plurality of vias; and

forming conductive adhesive deposits over said first plurality of vias, said conductive adhesive deposits conduct said driving signals.

2. A method as in claim 1 wherein said display structure is a flat panel display structure and wherein said electrical signals drive pixels images of said flat panel display structure.

3. A method as in claim 1 wherein said backplane is one of an active matrix array of thin films transistors and an active matrix array of diodes.

4. A method as in claim 1 wherein each of said plurality of functional blocks is a microstructure.

5. A method as in claim 1 wherein said display medium is an electroluminescent medium.

6. A method as in claim 5 wherein said electroluminescent medium is made of any one of organic light emitting diode organic materials, light emitting polymer materials, polymer light emitting diodes, and thin film electroluminescent displays.

7. A method as in claim 1 wherein said display medium is formed from a solid film.

8. A method as in claim 1 further comprising:

coating said plurality of output pads with an insulation layer having plurality of vias.

9. A method as in claim 1 wherein said second electrode layer is transparent.

10. A method as in claim 1 wherein said first electrode layer is an anode layer made out of a transparent conducting material.

11. A method as in claim 1 wherein said first electrode layer is made of a high workfunction material.

12. A method as in claim 1 wherein said second electrode layer is made of a low workfunction material.

13. A method as in claim 1 wherein said first electrode layer is any one of an indium tin oxide and a mixture of indium oxide and tin oxide material.

14. A method as in claim 1 wherein said second electrode layer is made from any one of an aluminum, a calcium, and a magnesium.

15. A method as in claim 1 wherein said frontplane substrate is made out of anyone of a silica, glass, transparent polymer, sapphire, quartz, and transparent plastic.

16. A method as in claim 1 wherein said backplane substrate is made out of material selected from the group consisting of ceramic, glass, plastic, silicon wafer, gallium arsenide wafer, silica, and metal.

17. A method as in claim 1 wherein said backplane substrate is any one of a rigid substrate and a flexible substrate.

18. A method as in claim 1 further comprising:

coating a pressure sensitive conductive layer over said plurality of output pads;

treating said pressure sensitive conductor layer such that said pressure sensitive conductor layer includes conducting regions and nonconducting regions, said conducting regions matching with said plurality of output pads and said connecting regions.

19. A method as in claim 18 wherein said pressure sensitive conductor layer is a patternable pressure sensitive adhesive wherein said treating includes patterning said patternable pressure sensitive adhesive.

20. A method as in claim 18 wherein said pressure sensitive conductor layer is a Z-direction conductive film conducting only in a perpendicular direction to a top surface and a bottom surface of said Z-direction conductive film.

21. A display structure comprising:

a frontplane coupling to a backplane, a first top surface of said frontplane laminates to a second top surface said backplane, said frontplane and said backplane are fabricated separately, said frontplane further includes a frontplane substrate and said backplane further includes a backplane substrate, wherein;

a first electrode layer which is transparent is disposed over said frontplane substrate;

a display medium which produces electro-optical effects upon a voltage application is disposed over said first electrode;

a second electrode layer which is patterned is disposed over said display medium, said second electrode layer includes a plurality of connecting regions; and

said backplane is electrically active to provide driving signals for said display medium wherein said backplane substrate includes a plurality of output pads to match said plurality of connecting regions;

an insulation layer having a plurality of vias formed over said plurality of output pads; and

conductive adhesive deposits formed over said first plurality of vias, said conductive adhesive deposits conduct said driving signals.

22. A display structure as in claim 21 wherein said electroluminescent display structure is a flat panel display structure and wherein said electrical signals drive pixels of said flat panel display structure.

23. A display structure as in claim 21 wherein said backplane is one of an active matrix array of thin films transistors and an active matrix array of diodes.

24. A display structure as in claim 21 wherein each of said plurality of functional blocks is a microstructure.

25. A display structure as in claim 21 wherein said display medium is an electroluminescent medium.

26. A display structure as in claim 25 wherein said electroluminescent medium is made of any one of organic light emitting diode organic materials, light emitting polymer materials, polymer light emitting diodes, and thin film electroluminescent displays.

27. A display structure as in claim 21 wherein said display medium is formed from a solid film.

28. A display structure as in claim 21 further includes an insulation layer having a plurality of vias formed over said plurality of output pads.

29. A display structure as in claim 21 wherein said second electrode layer is transparent.

30. A display structure as in claim 21 wherein said first electrode layer is an anode layer made out of a transparent conducting material.

31. A display structure as in claim 21 wherein said first electrode layer is any one of an indium tin oxide and a mixture of indium oxide and tin oxide.

32. A display structure as in claim 21 wherein said first electrode layer is made of a high workfunction material.

33. A display structure as in claim 21 wherein said second electrode is made of material having a low workfunction value.

34. A display structure as in claim 21 wherein said second electrode layer is made from any one of an aluminum, a calcium, and a magnesium.

35. A display structure as in claim 21 wherein said frontplane substrate is made out of anyone of a silica, glass, transparent polymer, sapphire, quartz, and transparent plastic.

36. A display structure as in claim 21 wherein said backplane substrate is made out of material selected from the group consisting of ceramic, glass, plastic, silicon wafer, gallium arsenide wafer, silica, and metal.

37. A display structure as in claim 21 wherein said backplane substrate is any one of a rigid substrate and a flexible substrate.

38. A display structure as in claim 21 further comprising a pressure sensitive conductive layer coated over said plurality of output pads, said pressure sensitive conductor layer is treated such that said pressure sensitive conductor layer further includes conducting regions and nonconducting regions, said conducting regions matching with said plurality of output pads and said connecting regions.

39. A display structure as in claim 38 wherein said pressure sensitive conductor layer is a patternable pressure sensitive adhesive wherein said patternable pressure sensitive conductor layer is patterned to include said conducting regions and said nonconducting regions to match said plurality of said connecting regions.

40. A display structure as in claim 38 wherein said pressure sensitive conductor layer is a Z-direction conductive film conducting only in a perpendicular direction to a top surface and a bottom surface of said Z-direction conductive film.