Cartridge for electronic devices

• US 6,845,014 B2
• Filed: 12/03/2003
• Issued: 01/18/2005
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/727,400
• Publication Number:
  US 20040141294A1
• Time in Patent Office: 412 Days
• Field of Search: 361/687, 361/690, 361/692, 361/694, 361704-712, 361717-719, 361726-727, 365/52, 365/63, 165/80.3, 165/185, 235/380, 235/441, 235/492, 174/35.R, 174/51
• US Class Current: 361/719
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.

Claims

1. An information processing device comprising:

a heat conductive element;

a processor in thermal communication with said heat conductive element, wherein said processor generates heat when energized, and wherein said beat conductive element dissipates heat generated by said processor;

a circuit board comprising a mounting area, wherein said processor is mounted at said mounting area; and

a compressible element,

wherein the circuit board is between the compressible element and the processor.

2. The information processing device of claim 1 wherein the information processing device is a cartridge.

3. The information processing device of claim 1 wherein the compressible element pushes the circuit board and the processor toward the heat conductive element.

4. The information processing device of claim 1 wherein the heat conductive element is a heat dissipation plate.

5. The information processing device of claim 1 wherein the heat conductive element comprises aluminum.

6. The information processing device of claim 1 wherein the compressible element comprises silicon rubber.

7. The information processing device of claim 1 further comprising an electrical contact at an edge region of the circuit board.

8. The information processing device of claim 1 wherein the circuit board is a printed circuit board.

9. The information processing device of claim 1 further comprising a ROM on the circuit board.

10. The information processing device of claim 1 further comprising a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material directly contacts the processor and the beat conductive element.

11. The information processing device of claim 10 wherein the heat dissipating material is formed from a non-solid material.

12. The information processing device of claim 1 wherein the compressible element comprises an elastic material.

13. The information processing device of claim 1 further comprising a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material comprises silicon rubber.

14. The information processing device of claim 1 wherein the processor is a microprocessor.

15. The information processing device of claim 1 further comprising a plurality of pins coupled to the processor, the pins being perpendicular to the orientation of the circuit board.

16. An information processing device comprising:

a heat conductive element;

a processor in thermal communication with said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor;

a circuit board comprising a mounting area, wherein said processor is mounted at said mounting area;

a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material directly contacts the heat conductive element and the processor; and

an insertion plug including an electrical contact formed at an end region of the circuit board,

and wherein the information processing device further comprises a plurality of pins coupled to the circuit board, the plurality of pins oriented perpendicular to the orientation of the circuit board.

17. The information processing device of claim 16 wherein the heat conductive element is a plate.

18. The information processing device of claim 16 wherein the heat dissipating material has a heat conductance rate of 1 W/m·

K or more.

19. The information processing device of claim 16 wherein the heat dissipating material is formed from a non-solid material.

20. The information processing device of claim 16 wherein the heat conductive element comprises aluminum.

21. The information processing device of claim 16 wherein the heat dissipating material comprises silicon rubber.

22. The information processing device of claim 16 wherein the information processing device is in the form of a cartridge.

23. The information processing device of claim 16 wherein the circuit board is a printed circuit board.

24. The information processing device of claim 16 further comprising a biasing element adapted to push the circuit board towards the heat conductive element.

25. The information processing device of claim 16 further comprising a housing configured to protect the processor.

26. The information processing device of claim 16 wherein the heat conductive element is in the form of a plate, and wherein the information processing device further comprises a ROM on the circuit board.