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MEMS direct chip attach packaging methodologies and apparatuses for harsh environments

  • US 6,845,664 B1
  • Filed: 10/03/2002
  • Issued: 01/25/2005
  • Est. Priority Date: 10/03/2002
  • Status: Expired due to Term
First Claim
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1. A method of bulk packaging sensors, comprising the steps of:

  • placing a bottom substrate having an array of sensor housings in a holding device to receive sensors, each of said sensor housings having an aperture therein;

    inserting a sensor having contact pads in each housing of said bottom substrate;

    and, placing a top substrate having an array of covers onto each respective sensor.

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