Shock protectors for micro-mechanical systems

• US 6,846,088 B2
• Filed: 12/01/2003
• Issued: 01/25/2005
• Est. Priority Date: 09/27/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kwon, Haesung
• Primary Examiner(s): SIKDER, MOHAMMAD YUNUS
• Application Number:
  US10/726,098
• Publication Number:
  US 20040120058A1
• Time in Patent Office: 421 Days
• Field of Search: 359/876, 359/877, 359221-224, 359/846, 359290-295, 310/36, 310/40
• US Class Current: 359/876
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

The present invention is directed towards shock protectors for a pedestal suspended over a lower surface by a plurality of gimbal springs. Each gimbal spring is connected to a linkage arm that attaches to an actuator. A stop located below the bottom of the pedestal prevents the gimbal springs and/or other structures from impacting the lower surface. In addition, the stop prevents excessively high strain in the gimbal springs. A shock absorber extending from at least one linkage arm serves a similar purpose when the pedestal is tilted, rather than simply displaced.

Claims

1. method for increasing heat transfer from a mirror coupled to a pedestal suspended by gimbal springs over a lower surface, the method comprising:

providing a solid heat-conduction path to the lower surface, the solid heat-conduction path being located within 3 μ

m of the pedestal.

2. The method, according to claim 1, wherein the solid heat-conduction path has a cross-sectional area that is at least 4 times greater than the cross-sectional area of the pedestal.

3. The method, according to claim 1, wherein the heat transfer from the mirror is increased by at least 10%.

4. The method, according to claim 1, wherein the solid heat-conduction path includes a high-conductivity material.