Semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a semiconductor substrate including a circuit element-forming region in which an integrated circuit is formed, and a plurality of connection pads;
an organic insulating film formed on said circuit element-forming region;
a plurality of columnar electrodes which each have an upper edge surface outwardly exposed for connection to an external device, including at least one columnar electrode formed over the circuit element-forming region;
a plurality of conductive layers formed on the organic insulating film and electrically connecting at least the connection pads and the at least one columnar electrode arranged over the circuit element-forming region;
at least one thin film passive element including a conductive layer formed on said insulating film, wherein the conductive layer of the thin film passive element and the plurality of conductive layers are laterally arranged and formed by a same layer of the semiconductor device; and
a sealing film which is provided between the columnar electrodes, and which covers the thin film passive element and the semiconductor substrate except for the upper edge surface of each of the columnar electrodes.
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Abstract
A thin film passive element includes at least one of a capacitance element having a plurality of conductive layers and a dielectric material layer and an inductance element formed of a patterned conductive layer is stacked on a circuit element-forming region of a semiconductor substrate provided with a plurality of connection pads and is connected to the circuit element of the circuit element-forming region.
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Citations
23 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate including a circuit element-forming region in which an integrated circuit is formed, and a plurality of connection pads;
an organic insulating film formed on said circuit element-forming region;
a plurality of columnar electrodes which each have an upper edge surface outwardly exposed for connection to an external device, including at least one columnar electrode formed over the circuit element-forming region;
a plurality of conductive layers formed on the organic insulating film and electrically connecting at least the connection pads and the at least one columnar electrode arranged over the circuit element-forming region;
at least one thin film passive element including a conductive layer formed on said insulating film, wherein the conductive layer of the thin film passive element and the plurality of conductive layers are laterally arranged and formed by a same layer of the semiconductor device; and
a sealing film which is provided between the columnar electrodes, and which covers the thin film passive element and the semiconductor substrate except for the upper edge surface of each of the columnar electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of manufacturing a semiconductor device comprising:
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preparing a semiconductor wafer substrate including a plurality of chip forming regions each having a circuit element-forming region in which an integrated circuit is formed, and a plurality of connection pads;
forming an organic insulating film on the circuit element-forming region of each of said chip forming regions;
forming a plurality of conductive layers connected to the connection cads;
forming a plurality of columnar electrodes which are provided for connection to an external device, and which are each electrically connected to at least one of said plurality of connection pads through said plurality of conductive layers. wherein at least one of said plurality of columnar electrodes is formed on said circuit element-forming region;
forming a plurality of thin film passive elements each including a conductive layer on said organic insulating film, wherein the conductive layer of the thin film passive element and the plurality of conductive layers are laterally arranged and formed by a same layer of the semiconductor device;
forming a sealing film on an exposed entire upper surface of the semiconductor wafer substrate between the columnar electrodes and covering the thin film passive elements and the columnar electrodes;
exposing only an upper edge surface of each of the columnar electrodes from the sealing film; and
dividing said semiconductor wafer substrate into individual chip forming regions so as to form a plurality of semiconductor devices each having at least one of said thin film passive elements. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification