Micro-scale interconnect device with internal heat spreader and method for fabricating same
First Claim
1. A micro-scale interconnect device for transmitting electrical current or discrete signals, comprising:
- (a) a first array of generally coplanar electrical communication lines disposed generally along a first plane;
(b) a second array of generally coplanar electrical communication lines disposed generally along a second plane spaced from the first plane and electrically isolated from the first array; and
(c) a heat spreader element comprising a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material, wherein the thermally conductive material is electrically isolated from the first and second rays and wherein the dielectric material comprises first and second dielectric layers, the first and second dielectric layers comprise exactly the same material.
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Accused Products
Abstract
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.
68 Citations
29 Claims
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1. A micro-scale interconnect device for transmitting electrical current or discrete signals, comprising:
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(a) a first array of generally coplanar electrical communication lines disposed generally along a first plane;
(b) a second array of generally coplanar electrical communication lines disposed generally along a second plane spaced from the first plane and electrically isolated from the first array; and
(c) a heat spreader element comprising a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material, wherein the thermally conductive material is electrically isolated from the first and second rays and wherein the dielectric material comprises first and second dielectric layers, the first and second dielectric layers comprise exactly the same material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A micro-scale interconnect device for transmitting electrical current or discrete signals, comprising:
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(a) a first dielectric layer;
(b) a first layer of communication lines formed on the first dielectric layer;
(c) a second dielectric layer formed on the first layer of communication lines and on the first dielectric layer;
(d) a thermally conductive layer formed on the second dielectric layer;
(e) a third dielectric layer formed on the thermally conductive layer, wherein the first, second, and third dielectric layers comprise exactly the same material; and
(f) a second layer of communication lines formed on the third dielectric layer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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26. A micro-scale system comprising:
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(a) a first array of generally coplanar electrical communication lines disposed generally along a first plane;
(b) a second array of generally coplanar electrical communication lines disposed generally along a second plane spaced from the first plane and electrically isolated from the first array;
(c) a heat spreader element comprising a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material, wherein the thermally conductive material is electrically isolated from the first and second arrays and wherein the dielectric material comprises first and second dielectric layers, the first and second dielectric layers comprises exactly the same material; and
(d) a micro-scale device electrically communicating with a communication line of at least one of the first and second arrays. - View Dependent Claims (27, 28, 29)
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Specification