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Packaged semiconductor device for radio frequency shielding

  • US 6,847,115 B2
  • Filed: 09/06/2001
  • Issued: 01/25/2005
  • Est. Priority Date: 09/06/2001
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device package having first and second integrated circuits, comprising:

  • a housing having a hollow;

    first and second cavities beneath said hollow, wherein said first and second integrated circuits are located in said first and second cavities, respectively;

    a radio frequency shield located in said first cavity;

    a plurality of conductive contacts in said housing that pass from inside said housing to outside said housing; and

    a cover over said housing.

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