Packaged semiconductor device for radio frequency shielding

• US 6,847,115 B2
• Filed: 09/06/2001
• Issued: 01/25/2005
• Est. Priority Date: 09/06/2001
• Status: Expired due to Fees

• Current Assignee: Silicon Bandwidth Incorporated (Interplex Holdings Pte. Ltd.)
• Original Assignee: Silicon Bandwidth Incorporated (Interplex Holdings Pte. Ltd.)
• Inventors: Alcaria, Vicente D., Crane, Stanford W. Jr., Jeon, Myoung-Soo
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US09/946,553
• Publication Number:
  US 20030042582A1
• Time in Patent Office: 1,237 Days
• Field of Search: 257/728, 257/664, 257/659, 257/704, 257/710, 257/729, 257/730, 257/691, 257/698, 257/660, 257/787, 257/676, 257/675, 257/712, 257/713, 257/666, 257/725, 257/641, 257/640, 257/687, 257/672, 257/671, 257/674, 361/403, 361/424, 361/816, 361/818, 174/35.R
• US Class Current: 257/728
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.

Claims

1. A semiconductor device package having first and second integrated circuits, comprising:

a housing having a hollow;

first and second cavities beneath said hollow, wherein said first and second integrated circuits are located in said first and second cavities, respectively;

a radio frequency shield located in said first cavity;

a plurality of conductive contacts in said housing that pass from inside said housing to outside said housing; and

a cover over said housing.

2. A semiconductor device according to claim 1, wherein said cover is conductive.

3. A semiconductor device according to claim 1, wherein said radio frequency shield is electrically grounded.

4. A semiconductor device according to claim 1, further including a bonding connector electrically connecting said first integrated circuit to a conductive contact.

5. A semiconductor device according to claim 1, wherein said housing further includes a cavity holding said second integrated circuit.

6. A semiconductor device according to claim 5, further including a second bonding connector electrically connecting said second integrated circuit to said first integrated circuit.

7. A semiconductor device according to claim 6, further including a third bonding connector electrically connecting said second integrated circuit to a conductive contact.

8. A semiconductor device according to claim 5, wherein said cavity is a molded cavity, and wherein said molded cavity includes a beveled wall.

9. A semiconductor device according to claim 1, wherein said first integrated circuit includes analog components.

10. A semiconductor device according to claim 5, wherein said second integrated circuit includes a digital circuit.

11. A semiconductor device according to claim 1, wherein said plurality of conductive contacts are insert molded into said housing.

12. A semiconductor device according to claim 11, wherein said RF shield is insert molded into said housing.

13. A semiconductor device according to claim 1, wherein said cover includes copper.

14. A semiconductor device according to claim 1, wherein said plurality of conductive contacts include copper.

15. A semiconductor device comprising:

an integrated circuit;

a housing having a hollow;

a cavity beneath said hollow, wherein the cavity includes a beveled wall, and wherein said integrated circuit is mounted in the cavity;

a bonding conductor electrically connected to said integrated circuit, wherein said bonding conductor passes over the beveled wall; and

a cover over said housing.