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Flip chip semiconductor device having signal pads arranged outside of power supply pads

  • US 6,847,120 B2
  • Filed: 12/18/2001
  • Issued: 01/25/2005
  • Est. Priority Date: 12/21/2000
  • Status: Active Grant
First Claim
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1. A flip chip semiconductor device of a multiplexing-layered structure having a cell forming layer and a pad forming layer, comprising:

  • input and output cells formed in said cell forming layer together with macro-cells;

    power supply pads formed in said pad forming layer, and electrically connected to said input and output cells; and

    signal pads formed in said pad forming layer, electrically connected to said input and output cells, and only arranged in an area outside of an area of said power supply pads.

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