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Solid-state image pickup device for producing thinned image

  • US 6,847,401 B1
  • Filed: 08/17/1998
  • Issued: 01/25/2005
  • Est. Priority Date: 08/25/1997
  • Status: Expired due to Fees
First Claim
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1. A solid-state image pickup device for generating image signals in accordance with incident light, comprising:

  • a semiconductor substrate having one conductive type;

    a semiconductor region formed on one surface of said semiconductor substrate and having a conductive type opposite to said semiconductor substrate;

    a plurality of channel regions extending in a column direction respectively in said semiconductor region;

    a plurality of picture elements in which electric charges are accumulated defined in each portion of said plurality of channel regions; and

    a plurality of transfer electrodes, extending in a row direction on said semiconductor region, for transferring the electric charges accumulated in said plurality of channel regions, said plurality of transfer electrodes being allocated to each picture element;

    said plurality of picture elements including;

    light receiving elements in which the electric charges are accumulated in accordance with the incident light, and storage elements in which the electric charges transferred from said light receiving elements are stored;

    said plurality of light receiving elements including;

    a first set of a plurality of light receiving elements in which at least one of the corresponding transfer electrodes is activated and simultaneously at least one of the transfer electrodes is inactivated in first and second image pickup operations; and

    a second set of a plurality of light receiving elements in which all of the corresponding transfer electrodes are inactivated in the first image pickup operation, and at least one of the transfer electrodes is activated and simultaneously at least one of the transfer electrodes is inactivated in the second image pickup operation; and

    wherein the electric charges generated in the second set of light receiving elements are directly discharged from the second set of light receiving elements to the semiconductor substrate in the first image pickup operations;

    wherein a thinned-out image signal can be obtained before performing frame transfer to the storage section in the first image pickup operation; and

    wherein charges of the second set of light receiving elements are discarded by controlling voltages to transfer electrodes in the first image pickup operation.

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