Liquid crystal display device and method for manufacturing the same
First Claim
Patent Images
1. A method of manufacturing a liquid crystal display device, comprising the steps of:
- forming a metal layer on an insulating layer;
forming a passivation layer on the metal layer;
forming a photoresist pattern having an opening exposing a predetermined portion of the passivation layer and having a step-like pattern with at least two areas differing in thickness from each other;
forming a contact hole exposing portions of lateral and upper surfaces of the metal layer by selectively etching the passivation layer using the photoresist pattern as an etch mask;
removing the photoresist pattern; and
forming a transparent conductive material to be in contact with the exposed portions of the lateral and upper surfaces of the metal layer through the contact hole.
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Accused Products
Abstract
A liquid crystal display device and a method for manufacturing the same are provided. The device and method increase contact stability by forming a contact hole exposing the lateral and upper surfaces of a metal layer using a diffraction mask. The device includes a lower metal layer on a substrate; a passivation layer on the substrate including the lower metal layer; a contact hole on the passivation layer so as to expose the lateral and upper surfaces of the lower metal layer; and an upper metal layer in the contact hole and over the passivation layer, and in contact with the exposed lateral and upper surface of the lower metal layer.
7 Citations
14 Claims
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1. A method of manufacturing a liquid crystal display device, comprising the steps of:
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forming a metal layer on an insulating layer;
forming a passivation layer on the metal layer;
forming a photoresist pattern having an opening exposing a predetermined portion of the passivation layer and having a step-like pattern with at least two areas differing in thickness from each other;
forming a contact hole exposing portions of lateral and upper surfaces of the metal layer by selectively etching the passivation layer using the photoresist pattern as an etch mask;
removing the photoresist pattern; and
forming a transparent conductive material to be in contact with the exposed portions of the lateral and upper surfaces of the metal layer through the contact hole. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a liquid crystal display device, comprising the steps of:
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forming a semiconductor layer over a gate line on a substrate;
forming source and drain electrodes overlapped with sides of the semiconductor layer and forming an opaque metal layer overlapped with the gate line;
forming a photoresist pattern having openings exposing predetermined portions of the passivation layer over the drain electrode and the opaque metal layer respectively, wherein the photoresist pattern has a step-like pattern with at least two areas differing in thickness from each other;
forming first and second contact holes exposing at least portions of lateral and upper surfaces of the opaque metal layer and the drain electrode respectively by selectively etching the passivation layer using the photoresist pattern as an etch mask;
removing the photoresist pattern; and
forming a transparent conductive material to be in contact with the opaque metal layer and the drain electrode exposed through the first and second contact holes, respectively. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a liquid crystal display device, comprising the steps of:
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forming a gate line on a substrate;
forming a semiconductor layer over the gate line;
forming source and drain electrodes overlapped with sides of the semiconductor layer;
forming an opaque metal layer overlapped with the gate line;
forming a passivation layer on the substrate including the source and drain electrodes and the opaque metal layer;
forming a photoresist pattern having a step-like portion with thinner portions corresponding to first and second areas of the passivation layer;
forming first and second contact holes in the first and second areas of the passivation layer by using the photoresist pattern as a mask and thereby exposing portions of the opaque metal layer and the drain electrode;
removing the remaining photoresist pattern; and
forming a transparent conductive material to be in contact with the opaque metal layer and the drain electrode exposed through the first and second contact holes, respectively. - View Dependent Claims (13, 14)
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Specification