System and method of transferring dies using an adhesive surface

• US 6,848,162 B2
• Filed: 12/19/2002
• Issued: 02/01/2005
• Est. Priority Date: 08/02/2002
• Status: Expired due to Fees

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Primary Examiner(s): Hong, John C.
• Application Number:
  US10/322,702
• Publication Number:
  US 20040020038A1
• Time in Patent Office: 775 Days
• Field of Search: 294/58, 294/28, 296/00, 297/29, 297/43, 297/00, 297/40, 297/59, 414/627, 414/754, 414/772, 414/773
• US Class Current: 29/458
• CPC Class Codes: B29C 33/06 using radiation , e.g. electro-magnetic waves, induction heating
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49885 : with coating before or during assembling
• CPC Class Codes: Y10T 29/53039 : with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53191 : Means to apply vacuum directly to position or hold work part
• CPC Class Codes: Y10T 29/53261 : Means to align and advance work part

Abstract

A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.

Claims

1. A method for transferring a plurality of dies from a first surface to a second surface, comprising:

(a) positioning the second surface to be closely adjacent to the first surface that has a plurality of dies attached thereto;

(b) reducing a distance between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface; and

(c) moving apart the first surface and second surface, whereby the plurality of dies remain attached to the second surface.

2. The method of claim 1, further comprising:

(d) prior to step (b), applying an adhesive material to the second surface so that the adhesiveness of the second surface is greater than that of the first surface.

3. The method of claim 1, further comprising:

(d) prior to step (a), orienting the plurality of dies attached to the first surface so that at least one contact pad of each die of the plurality of dies is facing away from the first surface.

4. The method of claim 3, wherein step (c) comprises:

moving apart the first surface and second surface, whereby the plurality of dies remain attached to the second surface in a pads down manner.

5. The method of claim 1, further comprising:

(d) prior to step (a), orienting the plurality of dies attached to the first surface so that at least one contact pad of each die of the plurality of dies is facing toward the first surface.

6. The method of claim 5, wherein step (c) comprises:

moving apart the first surface and second surface, whereby the plurality of dies remain attached to the second surface in a pads up manner.

7. The method of claim 1, wherein the first surface is a scribed wafer, wherein step (a) comprises:

positioning the second surface to be closely adjacent to the scribed wafer that has the plurality of dies attached thereto.

8. The method of claim 1, wherein the first surface is a support surface, wherein step (a) comprises:

positioning the second surface to be closely adjacent to the support surface that has the plurality of dies attached thereto.

9. The method of claim 1, wherein the second surface is an intermediate surface, wherein step (a) comprises:

positioning the intermediate surface to be closely adjacent to the support surface that has the plurality of dies attached thereto.

10. The method of claim 1, wherein the second surface is a substrate, wherein step (a) comprises:

(1) positioning the substrate to be closely adjacent to the support surface that has the plurality of dies attached thereto.

11. The method of claim 1, wherein the substrate includes a plurality of antenna substrates, wherein step (a) comprises:

positioning the substrate to be closely adjacent to the support surface that has the plurality of dies attached thereto, wherein each antenna substrate of the plurality of substrates is positioned closely adjacent to a corresponding die of the plurality of dies.

12. A system for transferring a plurality of dies from a first surface to a second surface, comprising:

means for reducing a distance between the first surface and the second surface until a plurality of dies of the first surface contact the second surface and attach to the second surface; and

means for moving apart the first surface and second surface, whereby the plurality of dies remain attached to the second surface.

13. The system of claim 12, wherein said means for reducing a distance and said means for moving apart are overlapping.

14. The system of claim 12, wherein said means for reducing a distance and said means for moving apart are separate.

15. The system of claim 12, wherein the second surface is coated with an adhesive material so that an adhesiveness of the second surface is greater than that of the first surface.

16. The system of claim 12, wherein the plurality of dies of the first surface are oriented so that at least one contact pad of each die of the plurality of dies is facing toward the second surface immediately prior to contacting the second surface.

17. The system of claim 16, wherein the plurality of dies attach to the second surface in a pads down manner.

18. The system of claim 12, wherein the plurality of dies of the first surface are oriented so that at least one contact pad of each die of the plurality of dies is facing away from the second surface immediately prior to contacting the second surface.

19. The system of claim 18, wherein the plurality of dies attach to the second surface in a pads up manner.

20. The system of claim 12, wherein the first surface is a scribed wafer.

21. The system of claim 12, wherein the first surface is a support surface.

22. The system of claim 12, wherein the second surface is an intermediate surface.

23. The system of claim 12, wherein the second surface is a substrate.

24. The system of claim 23, wherein the substrate includes a plurality of antenna substrates.