Method for making switch with ultrasonically milled channel plate

• US 6,849,144 B2
• Filed: 06/17/2004
• Issued: 02/01/2005
• Est. Priority Date: 12/12/2002
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Wong, Marvin Glenn
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US10/871,721
• Publication Number:
  US 20050000620A1
• Time in Patent Office: 229 Days
• Field of Search: 156/73.1, 156/73.3, 156/250, 156/256, 156/257, 156/272.8, 156/325, 156/580.1, 156/580.2
• US Class Current: 156/73.1
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2029/008 using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
• CPC Class Codes: Y10T 156/1064 Partial cutting [e.g., grooving or incising]

Abstract

Disclosed herein is a method for making a fluid-based switch having a channel plate and a switching fluid. The method comprises 1) ultrasonically milling at least one feature into a channel plate, and 2) aligning the at least one feature cut in the channel plate with at least one feature on a substrate and sealing at least a switching fluid between the channel plate and the substrate. Alternate embodiments of the invention are also disclosed.

Claims

1. A method for making a switch, comprising:

a) ultrasonically milling at least one feature in a channel plate; and

b) aligning the at least one feature milled in the channel plate with at least one feature on a substrate and sealing at least a switching fluid between the channel plate and the substrate.

2. The method of claim 1, further comprising:

a) applying an adhesive to the channel plate;

b) laser ablating the adhesive from the at least one feature cut in the channel plate; and

c) using the adhesive to seal the switching fluid between the channel plate and the substrate.

3. The method of claim 2, wherein the adhesive is Cytop.

4. The method of claim 2, further comprising laser cutting at least one additional feature into the channel plate.

5. The method of claim 4, wherein the same laser is used for the laser cutting and laser ablating.

6. The method of claim 1, wherein a first feature that is ultrasonically milled in the channel plate is a channel for holding the switching fluid.

7. The method of claim 6, wherein a second feature that is ultrasonically milled in the channel plate is an actuating fluid channel, and wherein the method further comprises sealing an actuating fluid between the channel plate and the substrate.

8. The method of claim 1, wherein the features that are ultrasonically milled in the channel plate comprise a channel for holding the switching fluid and a pair of channels for holding an actuating fluid;

the method further comprising;

a) laser cutting a pair of channels connecting corresponding ones of the channels holding the actuating fluid to the channel holding the switching fluid; and

b) sealing an actuating fluid between the channel plate and the substrate.

9. The method of claim 1, wherein the at least one ultrasonically milled feature is at least two features of different depths that are milled at the same time.