Electrochemical microsensor package
First Claim
1. A chemical sensor package comprising:
- a. A substrate having a front surface and a back surface facing generally away from one another which surfaces extend generally in a common plane and which is comprised of a first non-conductive layer and a second non-conductive layer, the first layer being on the side of the substrate closer to the front surface of the substrate and being comprised of a polymer film, b. an electrically conductive trace extending in the plane of the substrate over an area in between the first and second substrate layers and having a front side facing toward the front surface of the substrate, the trace having a three-dimensional conductive circuit feature formed integrally therewith and projecting at least partly through the second non-conductive layer and outwardly of the back surface of the substrate for providing a readily connectable and disconnectable pressure interconnection to another element at said one side of said substrate, c. a sensing electrode overlying the trace at an area of trace between the first and second substrate layers and having a front side facing toward the front surface of the substrate and a back side facing toward the back surface of the substrate, the electrode being in electrical contact with the trace and d. a well extending into the substrate from the front surface to the front side of the electrode and being exposed to the front side of the electrode.
1 Assignment
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Accused Products
Abstract
An electrochemical microsensor package comprises a substrate matrix having a upper non-conductive layer and an adjacent lower non-conductive layer with a conductive trace or pad extending over an area therebetween. The conductive pad has integral therewith a projecting contact button that projects through and below the second non-conductive for making contact with external electrical contacts. A sensor electrode is positioned on the surface of the conductive pad toward the upper non-conductive layer and in electrical contact therewith. A well extends through the upper non-conductive layer to the upper surface of the electrode. The microsensor packages may be produced by electrodeposition of the conductive pad onto a conductive mandrel having depressions to form the contact button.
The microsensor package is fabricated into a microsensor by appropriate adaptation of the well of the microsensor package including applying an appropriate oxide or other layer over the electrode, introduction of an electrolyte or other sensing chemicals into the well and or applying a permeable or impermeable membrane over the top of the well.
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Citations
42 Claims
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1. A chemical sensor package comprising:
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a. A substrate having a front surface and a back surface facing generally away from one another which surfaces extend generally in a common plane and which is comprised of a first non-conductive layer and a second non-conductive layer, the first layer being on the side of the substrate closer to the front surface of the substrate and being comprised of a polymer film, b. an electrically conductive trace extending in the plane of the substrate over an area in between the first and second substrate layers and having a front side facing toward the front surface of the substrate, the trace having a three-dimensional conductive circuit feature formed integrally therewith and projecting at least partly through the second non-conductive layer and outwardly of the back surface of the substrate for providing a readily connectable and disconnectable pressure interconnection to another element at said one side of said substrate, c. a sensing electrode overlying the trace at an area of trace between the first and second substrate layers and having a front side facing toward the front surface of the substrate and a back side facing toward the back surface of the substrate, the electrode being in electrical contact with the trace and d. a well extending into the substrate from the front surface to the front side of the electrode and being exposed to the front side of the electrode.
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2. A chemical sensor package comprising:
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a. an electrically conductive copper foil having an upper face and an opposed lower face, b. a sensing electrode overlying the foil and having a lower side facing toward the upper face of the foil and in electrical communication with the foil and an opposed upper side facing away from the foil, c. a non-conductive overlay overlying and secured to the upper face of the foil and the upper side of the electrode and having an upper surface remote from the foil and electrode and d. a well extending into the non-conductive overlay from the upper surface thereof to the upper side of the electrode and being exposed to the upper side of the electrode. - View Dependent Claims (3, 4, 5)
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6. A chemical sensor package comprising:
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a. electrically conductive foil having an upper face and an opposed lower face, b. a sensing electrode overlying the foil and having a lower side facing toward the upper face of the foil and in electrical communication with the foil and an opposed upper side facing away from the foil, c. a non-conductive overlay overlying and secured to the upper face of the foil and the upper side of the electrode and having an upper surface remote from the foil and electrode, d. a well extending an into the non-conductive overlay from the upper surface thereof to the upper side of the electrode and being exposed to the upper side of the electrode and e. a three-dimensional conductive circuit feature formed integrally with the foil that projects below the lower face thereof for providing a readily connectable and disconnectable pressure interconnection to another element below the lower face of the foil. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A generally planar chemical sensor package comprising:
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a. an electrically conductive foil having an upper face and an opposed lower face, b. a sensing electrode overlying the foil and having a lower side facing toward the upper face of the foil and in electrical communication with the foil and an opposed upper side facing away from the foil, c. a non-conductive overlay overlying and secured to the upper face of the foil and the upper side of the electrode and having an upper surface remote from the foil and electrode, d. a well extending into the non-conductive overlay from the upper surface thereof to the upper side of the electrode and being exposed to the upper side of the electrode, e. a non-conductive substrate underlying and secured to the lower face of the foil and having a lower surface remote from the foil and f. a three-dimensional conductive circuit feature formed integrally with the foil that projects below the lower face thereof, through the non-conductive substrate and outwardly below the lower surface of the substrate for a readily connectable and disconnectable pressure interconnection to another element at the lower surface of the substrate. - View Dependent Claims (23, 24, 25)
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26. A method for forming a chemical sensor package which comprises:
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a. forming a conductive foil having an upper face and an opposed lower face and a three-dimensional conductive circuit feature formed integrally therewith that projects below the lower face thereof at a location on the foil for providing a readily connectable and disconnectable pressure interconnection to another element below the lower face of the foil, b. forming a sensing electrode on the foil with a lower side thereof facing toward the upper face of the foil and in electrical communication with the foil and an opposed upper side facing away from the foil and c. overlaying the upper face of the foil and the upper side of the electrode with a non-conductive overlayer, the overlayer having an upper surface remote from the foil and the electrode and having a well extending through the overlay from the upper surface thereof to the upper side of the electrode and being exposed to the upper side of the electrode. - View Dependent Claims (27, 28, 29, 30, 31)
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32. A method of forming a chemical sensor package which comprises:
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a. providing a mandrel having an electrically conductive surface configured to produce a foil when a conductive metal is electrodeposited thereupon, the surface having a depression therein, b. electrodepositing a conductive metal on the electrically conductive surface to form a foil having a lower face adjacent the mandrel surface and an opposed upper face remote from the mandrel surface and, at the depression in the mandrel surface, a three-dimensional circuit feature formed integrally therewith that project below the lower face thereof at a location on the foil for providing a readily connectable and disconnectable pressure interconnections to another element below the lower face of the foil, c. forming an electrode on the upper surface of the foil with the electrode having a lower surface adjacent and in electrical contact with the foil and an opposed upper surface, d. laminating a non-conductive coverlayer onto the upper surface of the foil and of the electrode on the mandrel, the non-conductive coverlayer having an lower surface adjacent the upper face of the foil and an opposed upper surface and having an opening therethrough at the location of the electrode, whereby to form a well extending from the upper surface of the cover layer to the upper surface of the electrode and e. separating the laminated coverlayer and foil from the mandrel. - View Dependent Claims (33, 34, 35, 36)
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37. A method for forming a chemical sensor package which comprises:
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a. forming a conductive copper foil having an upper face and an opposed lower face, b. forming a sensing electrode on the foil with a lower side thereof facing toward the upper face of the foil and in electrical communication with the foil and an opposed upper side facing away from the foil and c. overlaying the upper face of the foil and the upper side of the electrode with a non-conductive overlayer, the overlayer having an upper surface remote from the foil and the electrode and having a well extending through the overlay from the upper surface thereof to the upper side of the electrode and being exposed to the upper side of the electrode. - View Dependent Claims (38, 39, 40)
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41. A method of forming a chemical sensor package which comprises:
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a. providing a mandrel having an electrically conductive surface configured to produce a foil when a conductive metal is electrodeposited thereupon, b. electrodepositing a conductive metal on the electrically conductive surface to form a foil having a lower face adjacent the mandrel surface, c. forming an electrode on the upper surface of the foil with the electrode having a lower surface adjacent and in electrical contact with the foil and an opposed upper surface, d. laminating a non-conductive coverlayer onto the upper surface of the foil and of the electrode on the mandrel, the non-conductive coverlayer having an lower surface adjacent the upper face of the foil and an opposed upper surface and having an opening therethrough at the location of the electrode, whereby to form a well extending from the upper surface of the cover layer to the upper surface of the electrode and e. separating the laminated coverlayer and foil from the mandrel. - View Dependent Claims (42)
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Specification