Process for making microdevice with movable microplatform
First Claim
Patent Images
1. A process for making a microdevice (1), comprising the steps of:
- a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein;
step b) comprises the step of mountably connecting said at least one support member (4) to the base member;
step d) is performed after step b) and before step c) and comprises the step of mountably connecting said at least one hinge member (3) to said at least one support member (4);
step c) comprises the step of mountably connecting the microplatform (2) to said at least one hinge member (3);
step d) comprises the step of selectively electroforming said at least one binge member on said at least one support member (4);
step a) comprises the steps of;
i) providing a substrate (5);
ii) connecting at least one electrode (6) and at least one contact pad (8) onto a side of the substrate (5);
iii) covering said side with a protective layer (9); and
iv) providing at least one opening (10) in the protective layer (9) for accessing said at least one contact pad (8), thereby providing the base member;
step b) comprises the steps of;
v) covering, after step iv), said side with a first seed layer (11);
vi) covering, after step v), said side with a first photoresist layer (12); and
vii) photolithographically patterning the first photoresist layer (12) to produce at least one opening (13) on the first photoresist layer (12) that is aligned with said at least one opening (10) for accessing said at least one contact pad (8), said at least one support member (4) being selectively electroformed in said at least one opening (13) of the first photoresist layer (12); and
step d) comprises the steps of;
viii) covering, after step vii), said side with a second seed layer (14);
ix) covering the second seed layer (14) with a second photoresist layer (15); and
x) photolithographically patterning the second photoresist layer (15) to produce at least one opening (16) on the second photoresist layer (15) that is aligned with said at least one support member (4), said at least one hinge member (3) being selectively electroformed in said at least one opening (16) of the second photoresist layer (15).
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Abstract
A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.
27 Citations
24 Claims
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1. A process for making a microdevice (1), comprising the steps of:
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a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein; step b) comprises the step of mountably connecting said at least one support member (4) to the base member;
step d) is performed after step b) and before step c) and comprises the step of mountably connecting said at least one hinge member (3) to said at least one support member (4);
step c) comprises the step of mountably connecting the microplatform (2) to said at least one hinge member (3);
step d) comprises the step of selectively electroforming said at least one binge member on said at least one support member (4);
step a) comprises the steps of;
i) providing a substrate (5);
ii) connecting at least one electrode (6) and at least one contact pad (8) onto a side of the substrate (5);
iii) covering said side with a protective layer (9); and
iv) providing at least one opening (10) in the protective layer (9) for accessing said at least one contact pad (8), thereby providing the base member;
step b) comprises the steps of;
v) covering, after step iv), said side with a first seed layer (11);
vi) covering, after step v), said side with a first photoresist layer (12); and
vii) photolithographically patterning the first photoresist layer (12) to produce at least one opening (13) on the first photoresist layer (12) that is aligned with said at least one opening (10) for accessing said at least one contact pad (8), said at least one support member (4) being selectively electroformed in said at least one opening (13) of the first photoresist layer (12); and
step d) comprises the steps of;
viii) covering, after step vii), said side with a second seed layer (14);
ix) covering the second seed layer (14) with a second photoresist layer (15); and
x) photolithographically patterning the second photoresist layer (15) to produce at least one opening (16) on the second photoresist layer (15) that is aligned with said at least one support member (4), said at least one hinge member (3) being selectively electroformed in said at least one opening (16) of the second photoresist layer (15). - View Dependent Claims (2, 3)
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4. The A process for making a microdevice (1) comprising the steps of:
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a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein; step c) is performed before steps b) and d) and comprises the step of selectively electroforming the microplatform (2) on a sacrificial substrate (20);
step d) is performed before step b) and comprises the step of mountably connecting said at least one hinge member (3) to the microplatform (2);
step b) comprises the steps of mountably connecting said at least one support member (4) to said at least one hinge member (3), and removing the sacrificial substrate (20);
step a) comprises the step of mountably connecting said at least one support member (4) to the base member, after the step of removing the sacrificial substrate (20); and
step c) comprises the steps of;
i) covering a side of the sacrificial substrate (20) with a first seed layer (21);
ii) covering the first seed layer (21) with a first photoresist layer (22); and
iii) photolitographically patterning the first photoresist layer (22) to produce an opening (23) on the first photoresist layer (22), the microplatform (2) being selectively electroformed in the opening (23) of the first photoresist layer (22). - View Dependent Claims (5, 6, 7)
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8. A process for making a microdevice (1), comprising the steps of:
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a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein; step b) is performed before steps c) and d) and comprises the step of selectively electroforming said at least one support member (4) on a sacrificial substrate (20);
step d) is performed before step c) and comprises the step of mountably connecting said at least one hinge member (3) to said at least one support member (4);
step c) comprises the steps of mountably connecting the microplatform (2) to said at least one hinge member (3), and removing the sacrificial substrate (20);
step a) comprises the step of mountably connecting said at least one support member (4) to the base member, after the step of removing the sacrificial substrate (20); and
step b) comprises the steps of;
i) covering a side of the sacrificial substrate (20) with a first seed layer (21);
ii) covering the first seed layer (21) with a first photoresist layer (22); and
iii) photolitographically patterning the first photoresist layer (22) to produce at least one opening (29) on the first photoresist layer (22), said at least one support member (4) being selectively electroformed in said at least one opening (29) of the first photoresist layer (22). - View Dependent Claims (9, 10, 11, 12)
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13. A process for making a microdevice (1), comprising the steps of:
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a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein; step d) is performed before step c) and comprises the step of selectively electroforming said at least one hinge member (3) on a sacrificial substrate (20);
step c) comprises the steps of mountably connecting the microplatform (2) to said at least one hinge member (3) and removing the sacrificial substrate (20);
step b) is performed after step a) and comprises the steps of mountably connecting said at least one support member (4) to the base member; and
step d) comprises the steps of;
i) covering a side of the sacrificial substrate (20) with a first seed layer (21);
ii) covering the first seed layer (21) with a first photoresist layer (22); and
iii) photolitographically patterning the first photoresist layer (22) to produce at least one opening (27) on the first photoresist layer (22), said at least one hinge member (3) being selectively electroformed in said at least one opening (27) of the first photoresist layer (22). - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A process for making a microdevice (1), comprising the steps of:
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a) providing a base member;
b) selectively electroforming at least one support member (4) for supporting a microplatform (2) with respect to the base member;
c) selectively electroforming the microplatform (2); and
d) forming at least one flexible hinge member (3) for hingedly connecting the microplatform (2) to said at least one support member (4) and allowing relative movement of the microplatform (2) with respect to said at least one support member (4);
wherein; step d) is performed before step c) and comprises the step of selectively electroforming said at least one hinge member (3) on a sacrificial substrate (20);
step c) comprises the steps of mountably connecting the microplatform (2) to said at least one hinge member (3);
step b) is performed after step c) and comprises the steps of mountably connecting said at least one support member (4) to said at least one hinge member (3) and microplatform (2), and removing the sacrificial substrate (20);
step a) is performed after step b) and comprises the step of mountably connecting said at least one support member (4) to the base member; and
step d) comprises the steps of;
i) covering a side of the sacrificial substrate (20) with a first seed layer (21);
ii) covering the first seed layer (21) with a first photoresist layer (22); and
iii) photolitographically patterning the first photoresist layer (22) to produce at least one opening (27) on the first photoresist layer (22), said at least one hinge member (3) being selectively electroformed in said at least one opening (27) of the first photoresist layer (22). - View Dependent Claims (21, 22, 23, 24)
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Specification