Microfabricated devices for the storage and selective exposure of chemicals and devices

• US 6,849,463 B2
• Filed: 12/19/2002
• Issued: 02/01/2005
• Est. Priority Date: 03/02/2000
• Status: Expired due to Term

• Current Assignee: Microchips Biotech, Inc. (Keratin Biosciences, Inc.)
• Original Assignee: MicroCHIPS Inc.
• Inventors: Santini, John T. Jr., Sheppard, Norman F. Jr., Langer, Robert S., Young, Chung Chang
• Primary Examiner(s): Le, Long V.
• Assistant Examiner(s): Counts, Gary W.
• Application Number:
  US10/324,556
• Publication Number:
  US 20030104590A1
• Time in Patent Office: 775 Days
• Field of Search: 436/174, 436/518, 436/805, 436/806, 436/524, 435/285.2, 435/288.4, 435/288.7, 435/7.1, 435/174, 422/68.1, 422/102, 422/104, 422/57, 422/58, 422/82.03, 422/101, 422/186.27, 604/890.1, 604/891.1, 604/93.01, 128/899, 424/426
• US Class Current: 436/518
• CPC Class Codes: A61B 5/00 Measuring for diagnostic purposes radiation diagnosis A61B6/00; diagnosis by ultrasonic, sonic or infrasonic waves A61B8/00; Identification of persons
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/1473 invasive, e.g. introduced into the body by a catheter A61B5/1482 takes precedence
• CPC Class Codes: A61B 5/14865 invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors
• CPC Class Codes: A61K 47/6957 the form being a device or a kit, e.g. stents or microdevices
• CPC Class Codes: A61K 49/0002 General or multifunctional contrast agents, e.g. chelated agents
• CPC Class Codes: A61K 9/0004 Osmotic delivery systems; Sustained release driven by osmosis, thermal energy or gas
• CPC Class Codes: A61K 9/0009 involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis microelectromechanical systems A61K9/0097
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61P 3/10 for hyperglycaemia, e.g. antidiabetics
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00351 Means for dispensing and evacuation of reagents
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00819 Materials of construction
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00824 Ceramic
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/00833 : Plastic
• CPC Class Codes: B01J 2219/00835 : Comprising catalytically active material
• CPC Class Codes: B01J 2219/00844 : Comprising porous material
• CPC Class Codes: B01J 2219/00853 : Employing electrode arrangements
• CPC Class Codes: B01J 2219/00873 : Heat exchange
• CPC Class Codes: B01J 2219/00889 : Mixing micromixers B01F33/30
• CPC Class Codes: B01J 2219/00907 : using membranes
• CPC Class Codes: B01J 2219/00925 : Irradiation
• CPC Class Codes: B01J 2219/00952 : Sensing operations
• CPC Class Codes: B01J 2219/00957 : Compositions or concentrations
• CPC Class Codes: B01J 2219/00966 : pH
• CPC Class Codes: B01J 2219/0097 : Optical sensors
• CPC Class Codes: B01J 2219/00984 : Residence time
• CPC Class Codes: B01J 2219/00986 : Microprocessor
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/023 : Sending and receiving of information, e.g. using bluetooth
• CPC Class Codes: B01L 2300/049 : Valves integrated in closure
• CPC Class Codes: B01L 2300/0627 : Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0654 : Lenses; Optical fibres
• CPC Class Codes: B01L 2300/0819 : Microarrays; Biochips
• CPC Class Codes: B01L 2400/0677 : phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
• CPC Class Codes: B01L 3/50853 : with covers or lids
• CPC Class Codes: C40B 60/14 : for creating libraries
• CPC Class Codes: G01N 2035/00158 : Elements containing microarrays, i.e. "biochip"
• CPC Class Codes: G01N 2035/00247 : Microvalves
• CPC Class Codes: Y10T 29/49007 : Indicating transducer
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 436/25 : including sample preparation

Abstract

Microchip devices and methods of use are provided for the controlled exposure of a secondary device. In one embodiment, the microchip device include a substrate, a plurality of reservoirs in the substrate, a secondary device in one or more of the reservoirs, at least one barrier layer covering each of the reservoirs to isolate the secondary device from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component, and a microprocessor-controlled actuation means for rendering the barrier layer porous or permeable to the environmental component to expose the secondary device to said environmental component. The secondary device can comprise a sensor or sensing component (e.g., a biosensor). In other embodiments, microchip devices are provided for the controlled exposure of a reacting component, such as an enzyme. In still other embodiments, sensors are provided on the device outside of the reservoirs.

Claims

1. A microchip device for controlled exposure of a reacting component comprising:

a substrate;

a plurality of reservoirs in the substrate;

a reacting component immobilized in the reservoirs;

at least one barrier layer covering each of the reservoirs to isolate the reacting component from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and

a microprocessor-controlled actuation means for disintegrating the barrier layer or for rendering the barrier layer porous or permeable to the environmental component, to expose the reacting component to said environmental component.

2. The microchip device of claim 1, wherein the reacting component comprises a catalyst.

3. The microchip device of claim 2, wherein the catalyst is an enzyme.

4. The microchip device of claim 1, further comprising a reaction control component mounted inside each of the reservoirs.

7. The microchip device of claim 1, wherein the microprocessor-controlled actuation means is activated at a specified time, or upon receipt of a signal from another device, or upon detection of a specified sensed condition.

8. The microchip device of claim 1, wherein the reacting component comprises an antibody.

9. The microchip device of claim 1, wherein the reacting component is selected from the group consisting of cells, proteins, nucleic acids, and polysaccharides.

10. The microchip device of claim 1, further comprising a cathode, wherein the barrier layer comprises an anode, whereby the barrier layer disintegrates upon application of an electric potential between the cathode and the anode.

11. The microchip device of claim 1, wherein barrier layer disintegrates to expose the reacting component.

12. The microchip device of claim 11, wherein the disintegration of the barrier layer occurs by loss of structural integrity due to a chemical reaction or phase change.

13. The microchip device of claim 11, wherein the disintegration of the barrier layer occurs by rupturing or fracturing.

14. The microchip device of claim 1, wherein the barrier layer comprises a metal layer.

15. The microchip device of claim 14, wherein the metal layer comprises gold.

16. The microchip device of claim 1, further comprising a layer of a dielectric material deposited on one or more surfaces of the device.

17. The microchip device of claim 16, wherein the dielectric material comprises a silicon oxide or a silicon nitride.

18. The microchip device of claim 1, wherein the reservoirs further include one or more microorganisms coated or immobilized on a surface inside the reservoirs.

19. The microchip device of claim 1, wherein the microprocessor-controlled actuation means comprises control circuitry, memory, and a power source.

20. The microchip device of claim 1, wherein the actuation means is operable using wireless transmission of power or data.

21. The microchip device of claim 4, wherein the reaction control component comprises a resistive heater or a polarizable electrode.

30. The microchip device of claim 1, which is encased in a biocompatible material.

5. A method of controlling exposure of a reacting component to an environmental component, the method comprising:

providing at a site, which comprises an environmental component, a microchip device which comprises a substrate, a plurality of reservoirs in the substrate, a reacting component immobilized in the reservoirs, at least one barrier layer covering each of the reservoirs to isolate the reacting component from the environmental component outside the reservoirs and at the site, wherein the barrier layer is impermeable to the environmental component, and a microprocessor-controlled actuation means for disintegrating the barrier layer or rendering the barrier layer porous or permeable to the environmental component; and

then

selectively disintegrating the barrier layer, or selectively rendering the barrier layer porous or permeable to the environmental component, to expose the reacting component to the environmental component.

6. The method of claim 5, wherein the reacting component comprises an enzyme or other catalyst.

25. The method of claim 5, wherein the site is in vivo.

26. The method of claim 5, wherein barrier layer is disintegrated to expose the reacting component.

27. The method of claim 26, wherein the disintegration of the barrier layer occurs by loss of structural integrity due to a chemical reaction or phase change.

28. The method of claim 26, wherein the disintegration of the barrier layer occurs by rupturing or fracturing.

29. The method of claim 26, wherein the barrier layer comprises a metal layer.

22. A microchip device comprising:

a substrate;

a plurality of reservoirs in the substrate;

a reacting component immobilized in each of the reservoirs;

at least one metal barrier layer covering each of the reservoirs to isolate the reacting component from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and

control circuitry and power source for selectively disintegrating the barrier layer of each reservoir to expose the reacting component to said environmental component.

23. The microchip device of claim 22, wherein the control circuitry and power source cause the barrier layer to disintegrate by loss of structural integrity due to a chemical reaction or phase change.

24. The microchip device of claim 22, wherein the control circuitry and power source cause the barrier layer to disintegrate by rupturing or fracturing.

31. A device comprising:

a substrate;

an array of discrete reservoirs in the substrate;

one or more reacting components immobilized in the reservoirs;

discrete barrier layers covering the reservoirs to isolate the one or more reacting components from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and

control circuitry and a power source for selectively disintegrating at least a portion of the barrier layers to expose the reacting component to said environmental component.

32. The device of claim 31, wherein the barrier layer covering a reservoir comprises two or more layers.

33. The device of claim 32, wherein the barrier layer comprises an outer layer and an inner layer, the outer layer comprising a metal reservoir cap, which is the portion of the barrier layer that is selectively disintegrated.

34. The device of claim 33, wherein the inner layer comprises a polymeric membrane permeable to the environmental component, and wherein the inner layer, after disintegration of the reservoir cap, remains disposed between the reaction component and the environment outside the reservoirs.

35. The device of claim 31, wherein the substrate comprises two or more substrate portions bonded together.

36. The device of claim 35, wherein at least one of the substrate portions comprises a silicon, ceramic, or glass.

37. The device of claim 31, wherein the reacting component is in a mixture with one or more other materials.

38. The device of claim 31, wherein the disintegration comprises a chemical reaction or phase change.