Barrier layers for microelectromechanical systems
First Claim
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1. A method comprising:
- depositing a first sacrificial layer;
depositing a first barrier layer after the first sacrificial layer;
forming a structural layer of a microelectromechanical device after the first barrier layer;
releasing the microelectromechanical device by removing the first sacrificial layer and the first barrier layer; and
wherein the first barrier layer prevents diffusion and reaction between the first sacrificial layer and the structural layer.
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Abstract
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
200 Citations
63 Claims
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1. A method comprising:
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depositing a first sacrificial layer;
depositing a first barrier layer after the first sacrificial layer;
forming a structural layer of a microelectromechanical device after the first barrier layer;
releasing the microelectromechanical device by removing the first sacrificial layer and the first barrier layer; and
wherein the first barrier layer prevents diffusion and reaction between the first sacrificial layer and the structural layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63)
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Specification