Method of adhesive bonding by induction heating
First Claim
1. A method of adhesive bonding by induction heating, comprising:
- providing at least two substrates to be bonded;
providing a susceptor structure therebetween, said susceptor structure having a length, width, and thickness, said structure including at least one layer of an electrically conductive material, said structure including at least one layer of an adhesive material proximal to at least one of its outer surfaces, said structure being of a first characteristic by which said at least one layer of electrically conductive material generates an eddy current when exposed to a magnetic field of a predetermined minimum intensity, and said structure being of a second characteristic by which said at least one layer of electrically conductive material exhibits a thickness in the range of 0.01 mils (0.25 microns) through 3 mils (76 microns).
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Accused Products
Abstract
A method for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, so as to bond, bind, or fasten solid materials to one another. The system uses alternating magnetic fields that induce eddy currents and generate heat within susceptors. An induction heating tool is used to emit the magnetic field at its work coil, and an electronic controller measures the energy being used by a power converter that generates the alternating current driving the work coil which creates the magnetic field. The heating tool is used in a method of adhesive bonding in which the thickness of the conductive layer of the susceptor is in the range of 0.01-3.0 mils, or the heating event time interval is in the range of 0.05-10.0 seconds, or the average power density of the magnetic field at the susceptor is in the range of 10-5000 Watts per square inch.
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Citations
20 Claims
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1. A method of adhesive bonding by induction heating, comprising:
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providing at least two substrates to be bonded;
providing a susceptor structure therebetween, said susceptor structure having a length, width, and thickness, said structure including at least one layer of an electrically conductive material, said structure including at least one layer of an adhesive material proximal to at least one of its outer surfaces, said structure being of a first characteristic by which said at least one layer of electrically conductive material generates an eddy current when exposed to a magnetic field of a predetermined minimum intensity, and said structure being of a second characteristic by which said at least one layer of electrically conductive material exhibits a thickness in the range of 0.01 mils (0.25 microns) through 3 mils (76 microns). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of adhesive bonding by induction heating, comprising:
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providing at least two substrates to be bonded;
providing a susceptor structure therebetween, said susceptor structure having a length, width, and thickness, said structure including at least one layer of an electrically conductive material, said structure including at least one layer of an adhesive material proximal to at least one of its outer surfaces, said structure being of a first characteristic by which said at least one layer of electrically conductive material generates an eddy current when exposed to a magnetic field of a predetermined minimum intensity; and
exposing said susceptor structure to a magnetic field during a heating event for a time interval in the range of 0.05-10 seconds, inclusive. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of adhesive bonding by induction heating, comprising:
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providing at least two substrates to be bonded;
providing a susceptor structure therebetween, said susceptor structure having a length, width, and thickness, said structure including at least one layer of an electrically conductive material, said structure including at least one layer of an adhesive material proximal to at least one of its outer surfaces, said structure being of a first characteristic by which said at least one layer of electrically conductive material generates an eddy current when exposed to a magnetic field of a predetermined minimum intensity; and
exposing said susceptor structure to a magnetic field during a heating event at an average power density in the range of 10-5000 Watts per square inch of susceptor area, inclusive. - View Dependent Claims (17, 18, 19, 20)
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Specification