Flip chip on glass sensor package
First Claim
Patent Images
1. A structure comprising:
- an image sensor having an active area and a bond pad on a first surface of said image sensor;
a window having an interior surface and an exterior surface opposite said interior surface, said interior surface of said window facing said first surface of said image sensor, the area of said interior surface of said window being less than the area of said first surface of said image sensor; and
an electrically conductive via extending through said window from said interior surface to said exterior surface of said window, said via being electrically connected to said bond pad.
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Abstract
An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the window. The window has an area less than an area of the front surface of the image sensor. A bead is formed between the window and the front surface of the image sensor thus forming a sealed cavity in which the active area is located. The bead has sides coplanar with sides of the image sensor such that the image sensor package is chip size.
96 Citations
28 Claims
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1. A structure comprising:
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an image sensor having an active area and a bond pad on a first surface of said image sensor;
a window having an interior surface and an exterior surface opposite said interior surface, said interior surface of said window facing said first surface of said image sensor, the area of said interior surface of said window being less than the area of said first surface of said image sensor; and
an electrically conductive via extending through said window from said interior surface to said exterior surface of said window, said via being electrically connected to said bond pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 27)
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20. An image sensor package comprising:
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an image sensor having an active area and bond pads on a first surface of said image sensor;
a window having an interior surface and mounted to said image sensor, the area of said interior surface of said window being less than the area of said first surface of said image sensor;
a plurality of electrically conductive interior traces on an interior surface of said window;
a plurality of electrically conductive bumps electrically and physically connecting said bond pads to said interior traces;
a plurality of electrically conductive vias extending from said interior surface of said window to an exterior surface of said window, said vias being electrically connected to said interior traces;
a plurality of electrically conductive exterior traces on said exterior surface of said window, said exterior traces being electrically connected to said vias;
a plurality of electrically conductive pads on said exterior traces; and
a plurality of electrically conductive interconnection balls on said electrically conductive pads. - View Dependent Claims (21, 22, 23, 24, 25)
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26. An image sensor package comprising:
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an image sensor having a bond pad on a first surface of said image sensor;
a window having an interior surface, the area of said interior surface of said window being less than the area of said first surface of said image sensor;
an electrically conductive interior trace on said interior surface of said window; and
an electrically conductive bump electrically connecting said bond pad to said interior trace.
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28. An image sensor package comprising:
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an image sensor having an active area and bond pads on a first surface of said image sensor;
a window mounted to said image sensor, the area of said window in a plane parallel to said first surface of said image sensor being less than the area of said first surface of said image sensor;
a plurality of electrically conductive interior traces on an interior surface of said window;
a plurality of electrically conductive bumps electrically and physically connecting said bond pads to said interior traces;
a plurality of electrically conductive vias extending from said interior surface of said window to an exterior surface of said window, said vias being electrically connected to said interior traces;
a plurality of electrically conductive exterior traces on said exterior surface of said window, said exterior traces being electrically connected to said vias;
a plurality of electrically conductive pads on said exterior traces; and
a plurality of electrically conductive interconnection balls on said electrically conductive pads.
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Specification