System and method for using film deposition techniques to provide an antenna within an integrated circuit package

• US 6,849,936 B1
• Filed: 09/25/2002
• Issued: 02/01/2005
• Est. Priority Date: 09/25/2002
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Berman, Michael J., Barber, Rennie G.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): FORDE, REMMON R
• Application Number:
  US10/254,473
• Time in Patent Office: 860 Days
• Field of Search: 257/679, 257/684, 257/685, 257/690, 257/698, 257/728, 257/725, 257/704, 257/710, 257/774, 257/680, 438/106, 438/110, 438/117, 438/121
• US Class Current: 257/679
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence

Abstract

An integrated circuit package comprises a cavity for housing an integrated circuit (IC) and an antenna provided as part of the package that is located substantially outside the cavity. The antenna may be located on the floor of the IC package that lies in the region outside of the IC cavity. Alternatively, the antenna may be located on the upper or lower surface of the lid sealing the IC package. The antenna may be placed in the floor or on a surface of the IC lid by forming depressions in the floor or lid surface and depositing conductive material in the depressions. The conductive material deposition may be by sputtering, evaporation, or other known physical or chemical deposition method. Antennas formed in the upper surface of an IC lid may be coupled to a pin of the IC package so that the antenna may be electrically coupled to a transceiver component on the IC within the package. Antennas formed in the lower surface of an IC lid or the floor of the IC package may be coupled by a conductive pin to a component pad of the IC within the package. To reduce electromagnetic noise that may be induced by the radio frequency signals emitted or received by an antenna, a grounding plane may be provided as part of the IC package. The grounding plane may be coupled to an electrical ground reference point through an IC package pin or the IC within the package.

Claims

1. An integrated circuit package for housing an integrated circuit comprising:

a cavity in an integrated circuit (IC) package for housing an IC;

an antenna provided as part of the IC package and located substantially outside the cavity, the antenna further comprising a conductive trace located on a lid for the IC package; and

a conductive tab for electrically coupling the conductive trace of the antenna to a pin of the IC package.

2. The package of claim 1 wherein the conductive trace is located on the upper surface of the lid for the IC package.

7. The package of claim 1 wherein the conductive trace is located on an outside surface of the lid for the IC package.

3. An integrated circuit package for housing an integrated circuit comprising:

a cavity in an integrated circuit (IC) package for housing an IC;

an antenna provided as part of the IC package and located substantially outside the cavity, the antenna further comprising a conductive trace located on a lid for the IC package; and

a grounding plane located between the antenna and the lid of the IC package.

8. The package of claim 3 wherein the conductive trace is located on an upper surface of the lid for the IC package.

9. The package of claim 3 wherein the conductive trace is located on an outside surface of the lid for the IC package.

4. A method for providing an antenna with an integrated circuit package comprising:

placing a conductive antenna trace outside an integrated circuit (IC) cavity on the lid of an IC package; and

coupling the conductive trace to the IC located in the IC cavity of the IC package by electrically coupling the conductive trace of the antenna to a pin of the IC package with a conductive tab.

5. The method of claim 4 wherein the conductive trace placement is on the upper surface of the lid for the IC package.

6. A method for providing an antenna with an integrated circuit package comprising:

placing an antenna trace outside an integrated circuit (IC) cavity on the lid of an IC package;

coupling the antenna trace to the IC located in the IC cavity of the IC package; and

placing a grounding plane between the antenna and the lid of the IC package.

10. The method of claim 6, wherein the placing of the antenna trace comprises the placing of the antenna trace on an outer surface of the lid of the IC package.