×

Semiconductor die analysis via fiber optic communication

  • US 6,850,081 B1
  • Filed: 06/05/2002
  • Issued: 02/01/2005
  • Est. Priority Date: 07/26/2001
  • Status: Expired due to Fees
First Claim
Patent Images

1. A system for analyzing circuitry in a semiconductor die, the system comprising:

  • a stimulation arrangement adapted to stimulate circuitry in the die;

    an optical signal generator adapted to generate optical signals in response to the stimulated circuitry and including a plurality of laser diodes and a multiplexer, wherein at least one of the laser diodes is adapted to convert a detected electrical characteristic into one of the optical signals; and

    an analysis device adapted to receive the optical signals and analyze the circuitry therefrom.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×