Semiconductor die analysis via fiber optic communication

• US 6,850,081 B1
• Filed: 06/05/2002
• Issued: 02/01/2005
• Est. Priority Date: 07/26/2001
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Bruce, Michael R., Birdsley, Jeffrey D., Davis, Brennan V., Ring, Rosalinda M., Stone, Daniel L.
• Primary Examiner(s): Karlsen, Ernest
• Application Number:
  US10/164,506
• Time in Patent Office: 972 Days
• Field of Search: 324/752, 324/501, 324/763, 324/765, 714/733, 714/734
• US Class Current: 324/754.23
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Abstract

Semiconductor analysis is improved via the use of fiber optic communications. According to an example embodiment of the present invention, a stimulation device is adapted to stimulate an integrated circuit die, and the die generates a response to the stimulation. An optical signal generator, either incorporated into the die or coupled to the die, detects the response, converts the response to an optical signal and transmits the optical signal. The optical signal is received at a testing arrangement adapted to analyze the die therefrom. The optical signal is used to analyze the die, improving signal quality and the ability to perform high-speed analysis of the die.

Claims

1. A system for analyzing circuitry in a semiconductor die, the system comprising:

a stimulation arrangement adapted to stimulate circuitry in the die;

an optical signal generator adapted to generate optical signals in response to the stimulated circuitry and including a plurality of laser diodes and a multiplexer, wherein at least one of the laser diodes is adapted to convert a detected electrical characteristic into one of the optical signals; and

an analysis device adapted to receive the optical signals and analyze the circuitry therefrom.

2. The system of claim 1, wherein the laser diodes and the multiplexer are formed at a package and coupled to the die.

3. The system of claim 1, wherein a multiplexer is adapted to receive a plurality of outputs from critical timing paths within a die and coordinate the outputs for transmission.

4. The system of claim 1, wherein the multiplexer device is adapted to selectively transmit the output of critical circuit paths in the die.

5. The system of claim 1, wherein the multiplexer device can be selectively engaged or disengaged.

6. The system of claim 1, wherein the multiplexer is adapted to detect electrical signals from the die and transmit the electrical signals to selected ones of the diodes, and wherein each of the diodes is adapted to convert the electrical signal to an optical signal.

7. The system of claim 1, wherein the diodes are adapted to detect electrical signals from the die and convert the signals to optical signals, and wherein the multiplexer is adapted to receive the converted optical signals and transmit selected ones of the optical signals.